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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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LT8607 датащи(PDF) 22 Page - Analog Devices |
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LT8607 датащи(HTML) 22 Page - Analog Devices |
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22 / 24 page  LT8607/LT8607B 22 Rev. D For more information www.analog.com PACKAGE DESCRIPTION 2.00 ±0.05 (4 SIDES) 2.00 SQ ±0.05 NOTE: 1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 0.55 ±0.05 BOTTOM VIEW—EXPOSED PAD 0.23 REF 0.335 REF 0.335 REF 0.75 ±0.05 1 4 8 5 PIN 1 BAR TOP MARK (SEE NOTE 6) 0.200 REF 0.00 – 0.05 (DC8MA) DFN 0113 REV Ø 0.23 ±0.05 0.45 BSC 0.25 ±0.05 RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 0.90 REF 0.23 REF 0.85 ±0.05 1.8 REF 1.8 REF 2.60 ±0.05 PACKAGE OUTLINE 0.45 BSC PIN 1 NOTCH R = 0.15 DC8 Package 8-Lead Plastic DFN (2mm × 2mm) (Reference LTC DWG # 05-08-1939 Rev Ø) Exposed Pad Variation AA |
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