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MP7651AS датащи(PDF) 5 Page - Exar Corporation

номер детали MP7651AS
подробное описание детали  8-Channel, Voltage Output 10 MHz Input Bandwidth 8-Bit Multiplying DACs with Serial Digital Data Port and Chip Select Decoder
PDF  20 Pages
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производитель  EXAR [Exar Corporation]
домашняя страница  http://www.exar.com
Logo EXAR - Exar Corporation

MP7651AS датащи(HTML) 5 Page - Exar Corporation

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MP7651
5
Rev. 2.00
ELECTRICAL CHARACTERISTICS TABLE
Description
Symbol
Min
Typ
Max
Min
Max
Units
Conditions
DIGITAL TIMING
SPECIFICATIONS2, 4
Input Clock Pulse Width
tCH, tCL
40
50
ns
Data Setup Time
tDS
10
10
ns
Data Hold Time
tDH
15
15
ns
CLK to SDO Propagation Delay
tPD
40
50
ns
DAC Register Load Pulse Width
tLD
100
100
ns
Reset Pulse Width
tRST
50
60
ns
Clock Edge to Load Rising Edge
tCKLD1
100
100
ns
Clock Edge to Load Falling Edge
tCKLD2
00
ns
Load Falling Edge to SDO
tHZ1
50
60
ns
3-state Enable
Load Rising Edge to SDO
tHZ2
35
50
ns
3-state Disable
Load Falling Edge to CLK Disable
tLDCK1
25
40
ns
Load Rising Edge to CLK Enable
tLDCK2
35
50
ns
LD Set-up Time with Respect
tLDSU
15
20
ns
to CLK
CS0-CS3 Set-Up Time with
tCSLD
25
35
ns
Respect to LD
25
°C
Tmin to Tmax
NOTES:
1
Full Scale Range (FSR) is 3V.
2
Guaranteed but not production tested.
3
Digital Input levels should not go below ground or exceed the positive supply voltage, otherwise damage may occur.
4
See Figures 2 and 3.
5
For reference input pulse: tR = tF > 100 ns.
Specifications are subject to change without notice
ABSOLUTE MAXIMUM RATINGS (TA = +25
°C unless otherwise noted)1, 2
VCC to GND
+6.5 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
VEE to GND
–6.5 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
VRi to GND
VCC to VEE
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
VOi to GND
VCC to VEE
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Digital Input & Output Voltage
to GND
GND –0.5 to VCC +0.5 V
. . . . . . . . . . . . . . . . . . . .
Operating Temperature Range
Extended Industrial
–40
°C to +85°C
. . . . . . . . . . . . . . . . . . .
Maximum Junction Temperature
150
°C
. . . . . . . . . . . . . . . . .
Storage Temperature
–65
°C to +150°C
. . . . . . . . . . . . . . . . .
Lead Temperature (Soldering, 10 sec)
+300
°C
. . . . . . . . . . .
Package Power Dissipation Rating @ 75
°C
PDIP, SOIC
1000mW
. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Derates above 75
°C
6mW/
°C
. . . . . . . . . . . . . . . . . . . . . .
NOTES:
1
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a
stress rating only and functional operation at or above this specification is not implied. Exposure to maximum rating
conditions for extended periods may affect device reliability.
2
Any input pin which can see a value outside the absolute maximum ratings should be protected by Schottky diode clamps
(HP5082-2835) from input pin to the supplies.
All inputs have protection diodes which will protect the device from short
transients outside the supplies of less than 100mA for less than 100
µs.
APPLICATIONS INFORMATION
Refer to Section 8 for Applications Information



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