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MPC7445 датащи(PDF) 46 Page - NXP Semiconductors

номер детали MPC7445
подробное описание детали  RISC Microprocessor Hardware Specifications
PDF  56 Pages
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производитель  NXP [NXP Semiconductors]
домашняя страница  http://www.nxp.com
Logo NXP - NXP Semiconductors

MPC7445 датащи(HTML) 46 Page - NXP Semiconductors

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MPC7447A RISC Microprocessor Hardware Specifications, Rev. 5
46
Freescale Semiconductor
System Design Information
the selection of any thermal interface material depends on many factors—thermal performance
requirements, manufacturability, service temperature, dielectric properties, cost, and so on.
Figure 23. Thermal Performance of Select Thermal Interface Material
The board designer can choose between several types of thermal interface. Heat sink adhesive materials
should be selected based on high conductivity and mechanical strength to meet equipment shock/vibration
requirements. There are several commercially available thermal interfaces and adhesive materials
provided by the following vendors:
The Bergquist Company
800-347-4572
18930 West 78th St.
Chanhassen, MN 55317
Internet: www.bergquistcompany.com
Chomerics, Inc.
781-935-4850
77 Dragon Ct.
Woburn, MA 01801
Internet: www.chomerics.com
Dow-Corning Corporation
800-248-2481
Dow-Corning Electronic Materials
2200 W. Salzburg Rd.
Midland, MI 48686-0997
Internet: www.dowcorning.com
0
0.5
1
1.5
2
0
1020
30
40
50607080
Silicone Sheet (0.006 in.)
Bare Joint
Fluoroether Oil Sheet (0.007 in.)
Graphite/Oil Sheet (0.005 in.)
Synthetic Grease
Contact Pressure (psi)



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