6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Supply voltage

6

V

–40

40

V

Common-mode

–0.3

85

V

–0.3

85

V

MOSI, MISO, SCLK, ALERT

GND – 0.3

Vs + 0.3

V

Input current into any pin

5

mA

Digital output current

10

mA

Junction temperature

150

°C

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

VIN+ and VIN– are the voltages at the IN+ and IN– pins, respectively.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/

JEDEC JS-001, all pins(1)

±2000

V

Charged device model (CDM), per JEDEC

specification JESD22-C101, all pins(2)

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Common-mode input range

–0.3

85

V

Operating supply range

2.7

5.5

V

Ambient temperature

–40

125

°C

6.4 Thermal Information

THERMAL METRIC(1)

INA239

UNIT

DGS (VSSOP)

10 PINS

Junction-to-ambient thermal resistance

177.6

°C/W

Junction-to-case (top) thermal resistance

66.4

°C/W

Junction-to-board thermal resistance

99.5

°C/W

Junction-to-top characterization parameter

9.7

°C/W

Junction-to-board characterization parameter

97.6

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

INA239

SLYS027 – JANUARY 2021

www.ti.com

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