Structural Adhesive Film

AF 31

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Storage at 40°F ± 5°F (4°C ± 2°C) is suggested for 3M™ Scotch-Weld™ Structural

Adhesive Film AF 31 and 3M™ Scotch-Weld™ Structural Adhesive Primer EC-2174 to

obtain maximum shelf life. Rotate stock on a “first in-first out” basis.

Caution: Scotch-Weld AF 31 film adhesive and Scotch-Weld EC-2174 primer should be

permitted to thoroughly warm to room temperature (75°F ± 5°F [24°C ± 2°C])

before being used to prevent moisture condensation.

Storage and

Handling

E. Suggested Cure Cycle

The following press cure cycle is suggested to obtain dense glue lines and maximum

strengths:

1. Apply a pressure of 45 psi prior to reaching a bond-line temperature of 150°F (66°C)

and maintain throughout the press cure cycle.

2. Raise the bond line temperature from ambient to 350°F (177°C) at a rate of 10°F per

minute.

3. Cure for 60 minutes at 350°F (177°C).

4. Cool to below 200°F (93°C) bond-line temperature prior to release of pressure. (In

lab tests, panels have been removed at 350°F (177°C), with no adverse effects).

Product

Application

(continued)

Shelf Life

Standard shelf life of Scotch-Weld AF 31 film adhesive is 12 months from date of

shipment in the original unopened container if stored at 40°F (4°C).