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AF31 датащи(PDF) 9 Page - 3M Electronics

номер детали AF31
подробное описание детали  3M Scotch-WeldTM Structural Adhesive Film
PDF  15 Pages
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производитель  3M [3M Electronics]
домашняя страница  http://www.3m.com
Logo 3M - 3M Electronics

AF31 датащи(HTML) 9 Page - 3M Electronics

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Scotch-WeldTM
Structural Adhesive Film
AF 31
- 9 -
11. Shear Strength of 3M™ Scotch-Weld™ Structural Adhesive Film AF 31/3M™ Scotch-Weld™
Structural Adhesive Primer EC-2174 on 410 Stainless Steel
Surface Preparation – Abraded with a Scotch-Brite™ Hand Pad soaked in methyl ethyl ketone – rinsed with
methyl ethyl ketone and air dried.*
Primer Dry – two brush coats – (30 minutes between coats) – air dried overnight.
Cure Cycle – 350°F (177°C) for 60 minutes, 50 psi, 10°F rise rate/minute.
*Note: When using solvents, extinguish all ignition sources and follow manufacturer’s precautions and
directions for use.
Product Performance
(continued)
Note: The following technical information and data should be considered representative
or typical only and should not be used for specification purposes.
Scotch-Weld AF 31/Scotch-Weld EC-2174
75°F (24°C)
300°F (149°C)
Overlap Shear Strength
4365 psi
2230 psi
12. Scotch-Weld AF 31 Film Adhesive Outgassing
The outgassing data at 10-6 torr was obtained on Scotch-Weld AF 31 film adhesive which had been cured
for 60 minutes at 350°F (177°C). The total weight loss and volatiles condensed were measured using
SP-R-0022A procedures.
Total Weight Loss
= 2.34%
Volatile Condensible Material = 0.33%
Coefficient of
Thermal Expansion
Below 35°F (2°C)
550 x 10-7 per °F
Above 35°F (2°C)
1360 x 10-7 per °F
13. Scotch-Weld AF 31 Film Adhesive Coefficient of Thermal Expansion
The coefficient of thermal expansion was obtained on Scotch-Weld AF 31 film adhesive cured at 350°F
(177°C) for 60 minutes under 100 psi with a rise rate to cure temperature of 200°F (93°C) per minute.



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