Structural Adhesive Film

AF 31

- 4 -

4. 3M™ Scotch-Weld™ Structural Adhesive Film AF 31 Overlap Shear on Aluminum Using Varied

Cure Times, Temperatures, and Pressures

The following data shows typical values obtained with Scotch-Weld AF 31 film adhesive in aluminum

overlap bonds. All properties were measured on 1" wide, 1/2" overlap specimens cut from .063" thick 4" x 7"

bonded panels of 2024 T3 clad aluminum. Tests were conducted according to MMM-A-132 methods. All

bonds were formed in a platen press.

Product Performance

(continued)

Note: The following technical information and data should be considered representative

or typical only and should not be used for specification purposes.

Cure Cycle

Overlap Shear (psi)

Temp.

Time

Pressure

Rise Rate

Test Temperature

(°F)

(°C)

(min.)

(psi)

(°F/min)

-67°F

75°F

180°F

250°F

300°F

350°F

400°F

450°F

500°F

600°F

(-55°C) (24°C) (82°C) (121°C) (149°C) (177°C) (204°C) (232°C) (260°C) (316°C)

350

177

60

150

200

2700

3700

2850

2500

2390

1700

1150

1100

800

250

350

177

10

150

200

2850

4200

2430

1975

350

177

5

150

200

2260

4200

2260

1610

350

177

60

45

200

2675

3740

2050

350

177

60

45

9

2800

3700

2100

1300

350

177

120

100

10

2647

2165

1790

250

121

120

75

10

4285

1225

250

121

24 hrs.

75

10

4375

2090

260

127

120

75

10

4150

1510

260

127

8 hrs.

75

10

4360

2000

325

163

60

20

200

2720

3360

1830

1370

840

350

177

60

20

200

2820

3280

2020

1720

1530

Cure Cycle

Platen

Time at

Time in

Pressure

Test

Overlap Shear

Temp.

Temp.

Press

(psi)

Temp.

(psi)

450°F (232°C)

5 sec.

85 sec.

300

75°F (24°C)

3000

450°F (232°C)

1 min.

140 sec.

300

75°F (24°C)

2900

450°F (232°C)

10 min.

11.25 min.

300

75°F (24°C)

2800

450°F (232°C)

384*

10 sec.

300

75°F (24°C)

2350

450°F (232°C)

412*

15 sec.

350

-40°F (-40°C)

3400

450°F (232°C)

412*

15 sec.

350

75°F (24°C)

3050

450°F (232°C)

412*

15 sec.

350

180°F (82°C)

2400

450°F (232°C)

412*

15 sec.

350

250°F (121°C)

1850

450°F (232°C)

412*

15 sec.

350

350°F (177°C)

1650

450°F (232°C)

412*

15 sec.

350

450°F (232°C)

1240

450°F (232°C)

419*

30 sec.

350

75°F (24°C)

3200

*Maximum bondline temperature attained (°F). Bond line did not attain platen temperature.