6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/

JEDEC JS-001, all pins(1)

±2000

V

Charged device model (CDM), per JEDEC

specification JESD22-C101, all pins(2)

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Common-mode input range

–0.3

85

V

Operating supply range

2.7

5.5

V

Ambient temperature

–40

125

°C

6.4 Thermal Information

THERMAL METRIC(1)

INA228

UNIT

DGS (VSSOP)

10 PINS

Junction-to-ambient thermal resistance

177.6

°C/W

Junction-to-case (top) thermal resistance

66.4

°C/W

Junction-to-board thermal resistance

99.5

°C/W

Junction-to-top characterization parameter

9.7

°C/W

Junction-to-board characterization parameter

97.6

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

INA228

SLYS021 – JANUARY 2021

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