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DP600 датащи(PDF) 10 Page - 3M Electronics |
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DP600 датащи(HTML) 10 Page - 3M Electronics |
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10 / 12 page ![]() 3M™Scotch-Weld™ Urethane AdhesivesDP600 Self-Leveling and DP600NS 10 The following surface preparations were used for substrates described in this Technical Data Sheet. A. Aluminum Etch Optimized FPL Etch - 3M (test method C-2803) 1. Alkaline degrease – Oakite 164 solution (9-11 oz./gallon water) at 190°F ± 10°F (88°C ± 5°C) for 10-20 minutes. Rinse immediately in large quantities of cold running water (3M test method C-2802). 2. Optimized FPL Etch Solution (1 liter): Material Amount Distilled Water 700 ml plus balance of liter (see below) Sodium Dichromate 28 to 67.3 grams Sulfuric Acid 287.9 to 310.0 grams Aluminum Chips 1.5 grams/liter of mixed solution To prepare 1 liter of this solution, dissolve sodium dichromate in 700 ml of distilled water. Add sulfuric acid and mix well. Add additional distilled water to fill to 1 liter. Heat mixed solution to 66 to 71°C (150 to 160°F). Dissolve 1.5 grams of 2024 bare aluminum chips per liter of mixed solution. Gentle agitation will help aluminum dissolve in about 24 hours. To FPL etch panels, place them in the above solution at 150 to 160°F (66 to 71°C) for 12 to 15 minutes. Note: Review and follow precautionary information provided by chemical suppliers prior to preparation of this etch solution. Rinse immediately in large quantities of clear running tap water. Dry – air dry approximately 15 minutes followed by force dry at 140°F (60°C) maximum for 10 minutes (minimum). 3. Both surface structure and chemistry play a significant role in determining the strength and permanence of bonded structures. It is therefore advisable to bond or prime freshly primed clean surfaces as soon as possible after surface preparation in order to avoid contamination and/or mechanical damage. Please contact your 3M sales representative for primer recommendations. B. Oakite Degrease Oakite 164 solutions (9-11 oz./gallon of water) at 190°F ± 10°F (88°C ± 5°C) for 2 minutes. Rinse immediately in large quantities of cold running water. C. MEK/Abrade/MEK Wipe surface with a methyl ethyl ketone (MEK) soaked swab, abrade and wipe with a MEK soaked swab.* Allow solvent to evaporate before applying adhesive. *Note: When using solvents, extinguish all ignition sources, including pilot lights, and follow the manufacturer’s precautions and directions for use. Surface Preparation (Continued) Surface Preparation |
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