RA4M1 datasheet(128/130 Pages) RENESAS

128 / 130 page

Address List

General Precautions

1. Precaution against Electrostatic Discharge (ESD)

A strong electrical field, when exposed to a CMOS device, can cause destruction of the gate oxide and ultimately

degrade the device operation. Steps must be taken to stop the generation of static electricity as much as possible, and

quickly dissipate it when it occurs. Environmental control must be adequate. When it is dry, a humidifier should be used.

This is recommended to avoid using insulators that can easily build up static electricity. Semiconductor devices must be

stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement

tools including work benches and floors must be grounded. The operator must also be grounded using a wrist strap.

Semiconductor devices must not be touched with bare hands. Similar precautions must be taken for printed circuit

boards with mounted semiconductor devices.

2. Processing at power-on

The state of the product is undefined at the time when power is supplied. The states of internal circuits in the LSI are

indeterminate and the states of register settings and pins are undefined at the time when power is supplied. In a finished

product where the reset signal is applied to the external reset pin, the states of pins are not guaranteed from the time

when power is supplied until the reset process is completed. In a similar way, the states of pins in a product that is reset

by an on-chip power-on reset function are not guaranteed from the time when power is supplied until the power reaches

the level at which resetting is specified.

3. Input of signal during power-off state

Do not input signals or an I/O pull-up power supply while the device is powered off. The current injection that results

from input of such a signal or I/O pull-up power supply may cause malfunction and the abnormal current that passes in

the device at this time may cause degradation of internal elements. Follow the guideline for input signal during power-

off state as described in your product documentation.

4. Handling of unused pins

Handle unused pins in accordance with the directions given under handling of unused pins in the manual. The input pins

of CMOS products are generally in the high-impedance state. In operation with an unused pin in the open-circuit state,

extra electromagnetic noise is induced in the vicinity of the LSI, an associated shoot-through current flows internally,

and malfunctions occur due to the false recognition of the pin state as an input signal become possible.

5. Clock signals

After applying a reset, only release the reset line after the operating clock signal becomes stable. When switching the

clock signal during program execution, wait until the target clock signal is stabilized. When the clock signal is generated

with an external resonator or from an external oscillator during a reset, ensure that the reset line is only released after full

stabilization of the clock signal. Additionally, when switching to a clock signal produced with an external resonator or

by an external oscillator while program execution is in progress, wait until the target clock signal is stable.

6. Voltage application waveform at input pin

Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the CMOS device

stays in the area between VIL (Max.) and VIH (Min.) due to noise, for example, the device may malfunction. Take care to

prevent chattering noise from entering the device when the input level is fixed, and also in the transition period when the

input level passes through the area between VIL (Max.) and VIH (Min.).

7. Prohibition of access to reserved addresses

Access to reserved addresses is prohibited. The reserved addresses are provided for possible future expansion of

functions. Do not access these addresses as the correct operation of the LSI is not guaranteed.

8. Differences between products

Before changing from one product to another, for example to a product with a different part number, confirm that the

change will not lead to problems. The characteristics of a microprocessing unit or microcontroller unit products in the

same group but having a different part number might differ in terms of internal memory capacity, layout pattern, and

other factors, which can affect the ranges of electrical characteristics, such as characteristic values, operating margins,

immunity to noise, and amount of radiated noise. When changing to a product with a different part number, implement a

system-evaluation test for the given product.

RA4M1 датащи(PDF) 128 Page - Renesas Technology Corp

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