NTP53X2 datasheet(6/133 Pages) NXP

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NXP Semiconductors

NTP53x2

NTAG 5 link - NFC Forum-compliant I2C bridge

NTP53x2

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 3.3 — 3 July 2020

COMPANY PUBLIC

544533

6 / 133

4 Ordering information

Table 1. Ordering information

Package

Orderable part

number

Name

Description

Version

NTP53121G0JHKZ

XQFN16

NTAG 5 link; with I2C interface and 2048 bytes user

EEPROM plastic,

extremely thin quad flat package; no leads; 16 terminals

SOT1161-2

NTP53121G0JTTZ

TSSOP16 NTAG 5 link; with I2C interface and 2048 bytes user

EEPROM plastic,

thin shrink small outline package; 16 leads; 0.65 mm pitch;

5 mm x 4.4 mm x 1.1 mm body

SOT403-1

NTP53121G0JTZ

SO8

NTAG 5 link; with I2C interface and 2048 bytes user

EEPROM plastic,

small outline package; 8 leads; 1.27 mm pitch;

4.9 mm x 3.9 mm x 1.75 mm body

SOT96-1

NTP53121G0FUAV

Wafer

NTAG 5 link; 8 inch wafer, 150 µm thickness, on film frame

carrier, electronic fail die marking according to SECS-II

format)

NTP53321G0JHKZ

XQFN16

NTAG 5 link with I2C master/slave interface, AES

authentication and 2048 bytes user EEPROM

plastic, extremely thin quad flat package; no leads; 16

terminals

SOT1161-2

NTP53321G0JTTZ

TSSOP16 NTAG 5 link with I2C master/slave interface, AES

authentication and 2048 bytes user EEPROM plastic,

thin shrink small outline package; 16 leads; 0.65 mm pitch;

5 mm x 4.4 mm x 1.1 mm body

SOT403-1

NTP53321G0JTZ

SO8

NTAG 5 link with I2C master/slave interface, AES

authentication and 2048 bytes user EEPROM plastic,

small outline package; 8 leads; 1.27 mm pitch;

4.9 mm x 3.9 mm x 1.75 mm body

SOT96-1

NTP53321G0FUAV

Wafer

NTAG 5 link; 8 inch wafer, 150 µm thickness, on film frame

carrier, electronic fail die marking according to SECS-II

format)

REMARK: Wafer specification addendum is available after exchange of a non-disclosure

agreement (NDA)

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