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LIS2DW12 датащи(PDF) 57 Page - STMicroelectronics |
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LIS2DW12 датащи(HTML) 57 Page - STMicroelectronics |
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57 / 66 page ![]() 9 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 9.1 Soldering information The LGA package is compliant with the ECOPACK®, RoHS and “Green” standard. It is qualified for soldering heat resistance according to JEDEC J-STD-020. Land pattern and soldering recommendations are available at www.st.com. 9.2 LGA-12 package information Figure 18. LGA-12 2.0 x 2.0 x 0.7 mm package outline and mechanical data Dimensions are in millimeter unless otherwise specified General Tolerance is +/-0.15mm unless otherwise specified OUTER DIMENSIONS ITEM DIMENSION [mm] TOLERANCE [mm] Length [L] 2 ±0.1 Width [W] 2 ±0.1 Height [H] 0.7 MAX / DM00170568_2 LIS2DW12 Package information DS11811 - Rev 8 page 57/66 |
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