8.6

Handling and storage precautions

8.6.1

Shock precaution

Sensor modules house numerous internal components that are susceptible to shock damage. If a unit is subject

to excessive shock, is dropped on the floor, or a tray/reel of units is dropped on the floor, it must be rejected, even

if no apparent damage is visible.

8.6.2

Part handling

Handling must be done with non-marring ESD safe carbon, plastic, or teflon tweezers. Ranging modules are

susceptible to damage or contamination. The customer is advised to use a clean assembly process after

removing the tape from the parts, and until a protective cover glass is mounted.

The sensor apertures are protected by a liner. This liner must be removed to ensure proper performance in the

final device. The liner should be removed at the latest possible step of the assembly process to help protect the

sensor from foreign material during the assembly process.

8.6.3

Compression force

A maximum compressive load of 25 N should be applied on the module.

8.6.4

Moisture sensitivity level

Moisture sensitivity is level 3 (MSL) as described in IPC/JEDEC JSTD-020-C.

8.7

Storage temperature conditions

Parameter

Min.

Typ.

Max.

Unit

Temperature (storage)

-40

23

85

°C

VL53L3CX

Handling and storage precautions

DS13204 - Rev 2

page 28/35