8.5

Lead-free solder reflow process

The figure and table below show the recommended and maximum values for the solder profile.

Customers have to tune the reflow profile depending on the PCB, solder paste, and material used. We expect

customers to follow the “recommended” reflow profile, which is specifically tuned for this specifice device

package.

If a customer must perform a reflow profile which is different from the “recommended” one (especially peak >240

°C), this new profile is qualified by the customer at their own risk. In any case, the profile has to be within the

“maximum” profile limit described in the table below.

Parameters

Recommended

Maximum

Units

130

200

90-110

150

200

60 - 120

°C

°C

s

Ramp up

217

55-65

2

217

55 - 65

3

°C

s

°C/s

Ramp up

—

—

—

250

10

3

°C

s

°C/s

240

260 max

°C

Time to peak

300

300

s

-4

-6

°C/s

Note:

The temperature mentioned in the above table is measured at the top of the device package.

Note:

The component is limited to a maximum of three passes through this solder profile.

Note:

As the device package is not sealed, only a dry re-flow process should be used (such as convection re-flow).

Vapor phase re-flow is not suitable for this type of optical component.

Note:

The device is an optical component and as such, it should be treated carefully. This would typically include using

a ‘no-wash’ assembly process.

VL53L3CX

Lead-free solder reflow process

DS13204 - Rev 2

page 27/35