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M95M04-DR датащи(PDF) 40 Page - STMicroelectronics |
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M95M04-DR датащи(HTML) 40 Page - STMicroelectronics |
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40 / 46 page ![]() Package information M95M04-DR 40/46 DS12179 Rev 1 10.2 WLCSP8 package information WLCSP is an 8-bump, 2.809 x 1.863 mm, wafer level chip scale package. Figure 25. WLCSP (with BSC) outline 1. Drawing is not to scale. 2. Dimension is measured at the maximum bump diameter parallel to primary datum Z. 3. Primary datum Z and seating plane are defined by the spherical crowns of the bump. 4. Bump position designation per JESD 95-1, SPP-010. Table 17. WLCSP mechanical data Symbol millimeters inches(1) Min Typ Max Min Typ Max A 0.500 0.540 0.580 0.0197 0.0213 0.0228 A1 - 0.190 - - 0.0075 - A2 - 0.325 - - 0.0128 - A3 - 0.025 - - 0.0010 - b(2) - 0.270 - - 0.0106 - D - 2.809 2.829 - 0.1106 0.1114 |
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