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LM2696MXAX датащи(PDF) 3 Page - National Semiconductor (TI) |
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LM2696MXAX датащи(HTML) 3 Page - National Semiconductor (TI) |
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3 / 19 page ![]() Absolute Maximum Ratings (Note 1) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Voltages from the indicated pins to GND AVIN −0.3V to +26V PVIN −0.3V to (AV IN+0.3V) CBOOT −0.3V to +33V CBOOT to SW −0.3V to +7V FB, SD, SS, PGOOD −0.3V to +7V Storage Temperature Range −65˚C to +150˚C Junction Temperature +150˚C Lead Temperature (Soldering, 10 sec.) 260˚C Minimum ESD Rating 1.5 kV Operating Range Junction Temperature −40˚C to +125˚C AVIN to GND 4.5V to 24V PVIN 4.5V to 24V Electrical Characteristics Specifications with standard typeface are for T J = 25˚C, and those in boldface type apply over the full Operating Temperature Range (T J = −40˚C to +125˚C). Minimum and Maximum limits are guaran- teed through test, design or statistical correlation. Typical values represent the most likely parametric norm at T J = 25˚C and are provided for reference purposes only. Unless otherwise specified V IN = 12V. Symbol Parameter Condition Min Typ Max Units V FB Feedback Pin Voltage V IN = 4.5V to 24V I SW =0Ato3A 1.225 1.254 1.282 V I CL Switch Current Limit V CBOOT =VSW +5V 3.6 4.9 6.4 A R DS_ON Switch On Resistance I SW = 3A 0.13 0.22 Ω I Q Operating Quiescent Current V FB = 1.5V 1.3 2 mA V UVLO AVIN Under Voltage Lockout Rising V IN 3.9 4.125 4.3 V V UVLO HYS AVIN Under Voltage Lockout Hysteresis 60 120 mV I SD Shutdown Quiescent Current V SD =0V 12 25 µA k ON Switch On-Time Constant I ON =50µAto100 µA 50 66 82 µA µs V DON R ON Voltage 0.35 0.65 0.95 V T OFF_MIN Minimum Off Time FB = 1.24V FB=0V 165 12 250 30 ns µs T ON MIN Minimum On-time 400 ns V EXTVCC EXTV CC Voltage 3.30 3.65 4.00 V ∆V EXTVCC EXTV CC Load Regulation I EXTVCC = 0 µA to 50 µA 0.03 0.5 % V PWRGD PGOOD Threshold (PGOOD Transition from Low to High) With respect to V FB 91.5 93.5 95.5 % V PG_HYS PGOOD Hysteresis 1 2.1 % I OL PGOOD Low Sink Current V PGOOD = 0.4V 0.5 2mA I OH PGOOD High Leakage Current 50 nA I FB Feedback Pin Bias Current V FB = 1.2V 0 nA I SS_SOURCE Soft-Start Pin Source Current V SS =0V 0.7 1 1.4 µA I SS SINK Soft-Start Pin Sink Current V SS = 1.2V V SD =0V 15 mA I SD Shutdown Pull-Up Current V SD =0V 1 3 µA V IH SD Pin Minimum High Input Level 1.8 V V IL SD Pin Maximum Low Input Level 0.6 V θ J-A Thermal Resistance 35.1 ˚C/W Note 1: Absolute Maximum Ratings indicate limits beyond which damage may occur to the device. Operating Ratings indicate conditions for which the device is intended to be functional, but do not guarantee specific performance limits. For guaranteed specifications, see Electrical Characteristics. Note 2: Without PCB copper enhancements. The maximum power dissipation must be derated at elevated temperatures and is limited by TJMAX (maximum junction temperature), θJ-A (junction to ambient thermal resistance) and TA (ambient temperature). The maximum power dissipation at any temperature is: PDissMAX =(TJMAX -TA)/θJ-A up to the value listed in the Absolute Maximum Ratings. θJ-A for TSSOP-16 package is 38.1˚C/W, TJMAX = 125˚C. www.national.com 3 |
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