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LM2696MXAX датащи(PDF) 3 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
номер детали LM2696MXAX
подробное описание детали  3A, Constant On Time Buck Regulator
PDF  19 Pages
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производитель  NSC [National Semiconductor (TI)]
домашняя страница  http://www.national.com
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Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Voltages from the indicated pins to GND
AVIN
−0.3V to +26V
PVIN
−0.3V to (AV
IN+0.3V)
CBOOT
−0.3V to +33V
CBOOT to SW
−0.3V to +7V
FB, SD, SS, PGOOD
−0.3V to +7V
Storage Temperature Range
−65˚C to +150˚C
Junction Temperature
+150˚C
Lead Temperature
(Soldering, 10 sec.)
260˚C
Minimum ESD Rating
1.5 kV
Operating Range
Junction
Temperature
−40˚C to +125˚C
AVIN to GND
4.5V to 24V
PVIN
4.5V to 24V
Electrical Characteristics Specifications with standard typeface are for T
J = 25˚C, and those in boldface
type apply over the full Operating Temperature Range (T
J = −40˚C to +125˚C). Minimum and Maximum limits are guaran-
teed through test, design or statistical correlation. Typical values represent the most likely parametric norm at T
J = 25˚C and
are provided for reference purposes only. Unless otherwise specified V
IN = 12V.
Symbol
Parameter
Condition
Min
Typ
Max
Units
V
FB
Feedback Pin Voltage
V
IN = 4.5V to 24V
I
SW =0Ato3A
1.225
1.254
1.282
V
I
CL
Switch Current Limit
V
CBOOT =VSW +5V
3.6
4.9
6.4
A
R
DS_ON
Switch On Resistance
I
SW = 3A
0.13
0.22
Ω
I
Q
Operating Quiescent Current
V
FB = 1.5V
1.3
2
mA
V
UVLO
AVIN Under Voltage Lockout
Rising V
IN
3.9
4.125
4.3
V
V
UVLO HYS
AVIN Under Voltage Lockout Hysteresis
60
120
mV
I
SD
Shutdown Quiescent Current
V
SD =0V
12
25
µA
k
ON
Switch On-Time Constant
I
ON =50µAto100 µA
50
66
82
µA µs
V
DON
R
ON Voltage
0.35
0.65
0.95
V
T
OFF_MIN
Minimum Off Time
FB = 1.24V
FB=0V
165
12
250
30
ns
µs
T
ON MIN
Minimum On-time
400
ns
V
EXTVCC
EXTV
CC Voltage
3.30
3.65
4.00
V
∆V
EXTVCC
EXTV
CC Load Regulation
I
EXTVCC = 0 µA to 50 µA
0.03
0.5
%
V
PWRGD
PGOOD Threshold (PGOOD Transition
from Low to High)
With respect to V
FB
91.5
93.5
95.5
%
V
PG_HYS
PGOOD Hysteresis
1
2.1
%
I
OL
PGOOD Low Sink Current
V
PGOOD = 0.4V
0.5
2mA
I
OH
PGOOD High Leakage Current
50
nA
I
FB
Feedback Pin Bias Current
V
FB = 1.2V
0
nA
I
SS_SOURCE
Soft-Start Pin Source Current
V
SS =0V
0.7
1
1.4
µA
I
SS SINK
Soft-Start Pin Sink Current
V
SS = 1.2V
V
SD =0V
15
mA
I
SD
Shutdown Pull-Up Current
V
SD =0V
1
3
µA
V
IH
SD Pin Minimum High Input Level
1.8
V
V
IL
SD Pin Maximum Low Input Level
0.6
V
θ
J-A
Thermal Resistance
35.1
˚C/W
Note 1: Absolute Maximum Ratings indicate limits beyond which damage may occur to the device. Operating Ratings indicate conditions for which the device is
intended to be functional, but do not guarantee specific performance limits. For guaranteed specifications, see Electrical Characteristics.
Note 2: Without PCB copper enhancements. The maximum power dissipation must be derated at elevated temperatures and is limited by TJMAX (maximum junction
temperature),
θJ-A (junction to ambient thermal resistance) and TA (ambient temperature). The maximum power dissipation at any temperature is: PDissMAX =(TJMAX
-TA)/θJ-A up to the value listed in the Absolute Maximum Ratings. θJ-A for TSSOP-16 package is 38.1˚C/W, TJMAX = 125˚C.
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