GND a nd p ower planes removed

und er the device pins in ord er to

minimize p arasitic ca pacita nce on

the sen sitive i nput an d o utp ut nod es.

C6 and C8 bypass capacitors

placed close to th e d evi ce

supply pins.

17

OPA2834

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SBOS973 – JUNE 2019

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11 Layout

11.1 Layout Guidelines

The OPA2837EVM can be used as a reference when designing the circuit board. TI recommends following the

EVM layout of the external components near to the amplifier, ground plane construction, and power routing as

closely as possible. Follow these general guidelines:

1. Signal routing must be direct and as short as possible into and out of the op amp.

2. The feedback path must be short and direct avoiding vias if possible, especially with G = 1 V/V.

3. Ground or power planes must be removed from directly under the negative input and output pins of the

amplifier.

4. TI recommends placing a series output resistor as close to the output pin as possible.

5. A 2.2-µF power-supply decoupling capacitor must be placed within two inches of the device and can be

shared with other op amps. For split supply, a capacitor is required for both supplies.

6. A 0.1-µF power-supply decoupling capacitor must be placed as close to the supply pins as possible,

preferably within 0.1 inch. For split supply, a capacitor is required for both supplies.

11.2 Layout Examples

Figure 17. EVM Layout Top Layer

Figure 18. EVM Layout Bottom Layer