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GD9FS1G8F2AMG датащи(PDF) 53 Page - GigaDevice Semiconductor (Beijing) Inc. |
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GD9FS1G8F2AMG датащи(HTML) 53 Page - GigaDevice Semiconductor (Beijing) Inc. |
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53 / 55 page ![]() SLC NAND FLASH GD9Fx1GxF2A 53 15. Revision History Version No. History Description Date 1.0 Update parameter page value Update package FBGA-63 information 2016-6-2 1.1 Change page size from 2K+64 to 2K+128 2016-7-12 1.2 Add CRC value in parameter page Remove tFEAT parameter Change Device resetting time for read from 5us to 10us Change Device resetting time for read from 10us to 20us Add parameter page CRC value table 2016-11-01 1.3 Add parameter page CRC arithmetic related description Update CRC table value Update Package information according Package vendor final file. 2016-11-15 1.4 Update R/B# Resistance figure with Trise and Tfall Update some figure with RD review. 2016-12-14 1.5 Update Part Numbering Information Add F code at field “Temperature Grade” for Full Function Test for Automotive application and No AECQ 2017-02-27 1.6 Remove last three code from part number 2017-06-26 1.7 Change VOL Max. from 0.1 to 0.4 Change ISB Max. from 30 to 50 Change IOL(R/B#) test condition VOL from 0.4V to 0.45V Change description with “The addressing must be done in sequential order in a block” for page program 2017-10-31 1.8 Add a note of P/E cycles with ECC Delete Commercial Temperature Grade. And add Industrial(J) (-40C ~ 105C) Temperature Grade 2017-11-14 1.9 Change P/E cycles with ECC from 50k to 100k, and delete note. Delete Industrial+(F):-40C~85C 2017-11-27 2.0 Change Operating Current Standby (Max.) from 30uA to 50uA Change VOH min from VCC-0.1 to VCC-0.3V Change Parameter page table Byte 105-106 ,108-109,and change CRC Value Change 1.8V tWP and tRP from 12 to 22, Change 1.8V tWH and tREH from 10 to 15 Change tCBSYW and tCBSYR from 3us to 5us Add the figure for Read Unique ID Timing. 2018-4-4 2.1 Update the tf and tr value in Figure26 :Ready/Busy figures Modify the typo of reliability of program/erase cycles with ECC in chapter 2 Add part numbers of GD9FU1G6F2AMG and GD9FS1G6F2AMG in chapter2.1 2018-5-2 2.2 Modify the description of Write Protect Add the chapter of 5.3 Factory Defect Mapping 2018-5-17 2.3 Modify the description of Common Page Program command Modify the sequence diagram of Cache Program Operation command (figure 19) 2018-9-3 |
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