DAC101S101 datasheet(5/19 Pages) NSC

5 / 19 page

A.C. and Timing Characteristics

Values shown in this table are design targets and are subject to change before product release. The following specifica-

tions apply for V

A = +2.7V to +5.5V, RL =2k

Ω to GND, C

L = 200 pF to GND, fSCLK = 30 MHz, input code range 12 to 1011.

Boldface limits apply for T

MIN

≤ T

MAX: all other limits TA = 25˚C, unless otherwise specified.

Symbol

Parameter

Conductions

Typical

Limits

Units

(Limits)

SCLK

SCLK Frequency

MHz (max)

Output Voltage Settling Time

(Note 10)

100h to 300h code

change, R

L =2k

Ω

≤ 200 pF

7.5

µs (max)

Output Slew Rate

V/µs

Glitch Impulse

Code change from 200h to 1FFh

nV-sec

Digital Feedthrough

0.5

nV-sec

Wake-Up Time

A = 5V

1.6

µs

A = 3V

1.9

µs

1/f

SCLK

SCLK Cycle Time

ns (min)

SCLK High time

ns (min)

SCLK Low Time

ns (min)

SUCL

Set-up Time SYNC to SCLK Rising

Edge

−15

ns (min)

SUD

Data Set-Up Time

2.5

ns (min)

DHD

Data Hold Time

2.5

4.5

ns (min)

SCLK fall to rise of SYNC

A =5V

ns (min)

A =3V

−2

ns (min)

SYNC

SYNC High Time

2.7

≤ V

≤ 3.6

ns (min)

3.6

≤ V

≤ 5.5

ns (min)

Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is

functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed

specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test

conditions.

Note 2: All voltages are measured with respect to GND = 0V, unless otherwise specified

Note 3: When the input voltage at any pin exceeds the power supplies (that is, less than GND, or greater than VA), the current at that pin should be limited to 10

mA. The 20 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 10 mA to two.

Note 4: The absolute maximum junction temperature (TJmax) for this device is 150˚C. The maximum allowable power dissipation is dictated by TJmax, the

junction-to-ambient thermal resistance (

θJA), and the ambient temperature (TA), and can be calculated using the formula PDMAX = (TJmax − TA)/ θJA. The values

for maximum power dissipation will be reached only when the device is operated in a severe fault condition (e.g., when input or output pins are driven beyond the

power supply voltages, or the power supply polarity is reversed). Obviously, such conditions should always be avoided.

Note 5: Human body model is 100 pF capacitor discharged through a 1.5 k

Ω resistor. Machine model is 220 pF discharged through ZERO Ohms.

Note 6: See the section entitled "Surface Mount" found in any post 1986 National Semiconductor Linear Data Book for methods of soldering surface mount devices.

Note 7: The analog inputs are protected as shown below. Input voltage magnitudes up to VA + 300 mV or to 300 mV below GND will not damage this device.

However, errors in the conversion result can occur if any input goes above VA or below GND by more than 100 mV. For example, if VA is 2.7VDC, ensure that −100mV

≤ input voltages ≤2.8VDC to ensure accurate conversions.

20154104

Note 8: To guarantee accuracy, it is required that VA be well bypassed.

Note 9: Typical figures are at TJ = 25˚C, and represent most likely parametric norms. Test limits are guaranteed to National’s AOQL (Average Outgoing Quality

Level).

Note 10: This parameter is guaranteed by design and/or characterization and is not tested in production.

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