MPC7455 datasheet(54/64 Pages) FREESCALE

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MPC7455 RISC Microprocessor Hardware Specifications, Rev. 4.1

Freescale Semiconductor

System Design Information

9.8 Thermal Management Information

This section provides thermal management information for the ceramic ball grid array (CBGA) package for

air-cooled applications. Proper thermal control design is primarily dependent on the system-level design—the heat

sink, airflow, and thermal interface material. To reduce the die-junction temperature, heat sinks may be attached to

the package by several methods—spring clip to holes in the printed-circuit board or package, and mounting clip and

screw assembly (see Figure 27); however, due to the potential large mass of the heat sink, attachment through the

printed-circuit board is suggested. If a spring clip is used, the spring force should not exceed 10 pounds.

Figure 27. Package Exploded Cross-Sectional View with Several Heat Sink Options

The board designer can choose between several types of heat sinks to place on the MPC7455. There are several

commercially available heat sinks for the MPC7455 provided by the following vendors:

Aavid Thermalloy

603-224-9988

80 Commercial St.

Concord, NH 03301

Internet: www.aavidthermalloy.com

Alpha Novatech

408-749-7601

473 Sapena Ct. #15

Santa Clara, CA 95054

Internet: www.alphanovatech.com

International Electronic Research Corporation (IERC)

818-842-7277

413 North Moss St.

Burbank, CA 91502

Internet: www.ctscorp.com

Tyco Electronics

800-522-6752

Chip Coolers™

P.O. Box 3668

Harrisburg, PA 17105-3668

Internet: www.chipcoolers.com

Thermal Interface Material

Heat Sink

CBGA Package

Heat Sink

Clip

Printed-Circuit Board

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