¡ Semiconductor

MSM548331

23/23

(Unit : mm)

PACKAGE DIMENSIONS

Notes for Mounting the Surface Mount Type Package

The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which

are very susceptible to heat in reflow mounting and humidity absorbed in storage.

Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the

product name, package name, pin number, package code and desired mounting conditions

(reflow method, temperature and times).

Package material

Lead frame material

Pin treatment

Solder plate thickness

Package weight (g)

Epoxy resin

42 alloy

Solder plating

5 mm or more

0.54 TYP.

TSOP

II44-P-400-0.80-K

Mirror finish