AD5293 datasheet(9/24 Pages) AD

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Data Sheet

AD5293

Rev. E | Page 9 of 24

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.

Table 6.

Parameter

Rating

VDD to GND

−0.3 V to +35 V

VSS to GND

+0.3 V to −25 V

VLOGIC to GND

−0.3 V to +7 V

VDD to VSS

35 V

VA, VB, VW to GND

VSS − 0.3 V, VDD + 0.3 V

Digital Input and Output Voltage to GND

−0.3 V to VLOGIC +0.3 V

EXT_CAP Voltage to GND

−0.3 V to +7 V

IA, IB, IW

Continuous

RAB = 20 kΩ

±3 mA

RAB = 50 kΩ, 100 kΩ

±2 mA

Pulsed1

Frequency > 10 kHz

MCC2/d3

Frequency ≤ 10 kHz

MCC2/√d3

Operating Temperature Range

−40°C to +105°C

Maximum Junction Temperature (TJ max)

150°C

Storage Temperature Range

−65°C to +150°C

Reflow Soldering

Peak Temperature

260°C

Time at Peak Temperature

20 sec to 40 sec

Package Power Dissipation

(TJ max − TA)/θJA

Maximum terminal current is bounded by the maximum current handling of

the switches, maximum power dissipation of the package, and maximum

applied voltage across any two of the A, B, and W terminals at a given

resistance.

Maximum continuous current.

Pulse duty factor.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 7. Thermal Resistance

Package Type

θJA

θJC

Unit

14-Lead TSSOP

931

°C/W

JEDEC 2S2P test board, still air (from 0 m/sec to 1 m/sec of air flow).

ESD CAUTION

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