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ADV7481WBBCZ датащи(PDF) 13 Page - Analog Devices

номер детали ADV7481WBBCZ
подробное описание детали  Integrated Video Decoder and Dual Mode HDMI/MHL Receiver
PDF  22 Pages
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производитель  AD [Analog Devices]
домашняя страница  http://www.analog.com
Logo AD - Analog Devices

ADV7481WBBCZ датащи(HTML) 13 Page - Analog Devices

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Data Sheet
ADV7481
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
Rating
TVDD, DVDDIO to GND
4 V
AVDD, PVDD, MVDD, DVDD, CVDD
to GND
2.2 V
CVDD to DVDD
−0.3 V to +0.3 V
MVDD to DVDD
−0.3 V to +0.3 V
PVDD to DVDD
−0.3 V to +0.3 V
AVDD to DVDD
−0.3 V to +0.3 V
Digital Inputs Voltage to GND
GND − 0.3 V to DVDDIO +
0.3 V
Digital Outputs Voltage to GND
GND − 0.3 V to DVDDIO +
0.3 V
Analog Inputs to GND
−0.3 V to AVDD + 0.3 V
XTALN and XTALP to GND
−0.3 V to PVDD + 0.3 V
HDMI/MHL Digital Inputs Voltage
to GND
−0.3 V to CVDD + 0.3 V
5 V Tolerant Inputs Voltage to
GND1, 2
−0.3 V to +5.5 V
Maximum Junction Temperature
(TJ max)
125°C
Storage Temperature Range
−65°C to +150°C
Infrared Reflow Soldering
(20 sec)
260°C
1
The following inputs are 3.3 V inputs but are 5 V tolerant:
DDC_SCL/CD_PULLUP, DDC_SDA, HPD/CBUS, RX_5V/VBUS, CD_SENSE and
CEC.
2
The following inputs are 1.8 V inputs but are 5 V tolerant: DIAG1, DIAG2,
DIAG3, and DIAG4.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
To reduce power consumption when using the ADV7481, turn
off unused sections of the device.
Due to printed circuit board (PCB) metal variation, and,
therefore, variation in PCB heat conductivity, the value of θJA
may differ for various PCBs.
The most efficient measurement solution is achieved using the
package surface temperature to estimate the die temperature.
This eliminates the variance associated with the θJA value.
Do not exceed the maximum junction temperature (TJ max) of
125°C. The following equation calculates the junction
temperature (TJ) using the measured package surface
temperature and applies only when no heat sink is used on the
device under test (DUT):
TJ = TS + (ΨJT ×WTOTAL)
where:
TS is the package surface temperature (°C).
ΨJT = 0.81°C/W for the 100-ball CSP_BGA (based on 2s2p test
board defined by JEDEC standards.
WTOTAL = (PVDD × IPVDD) + (TVDD × ITVDD) − PUpStream +
(CVDD × ICVDD) + (AVDD × IAVDD) + (DVDD × IDVDD) +
(DVDDIO × IDVDDIO) + (MVDD × IMVDD)
where PUpStream is the quantity of TVDD power consumed on the
upstream HDMI or MHL transmitter. PUpStream can be estimated
to be around 110 mW for a nominal HDMI transmitter. PUpStream
can be estimated to be around 42.82 mW for a nominal MHL
transmitter.
ESD CAUTION
Rev. 0 | Page 13 of 22



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