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ADV7481WBBCZ датащи(PDF) 13 Page - Analog Devices |
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ADV7481WBBCZ датащи(HTML) 13 Page - Analog Devices |
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13 / 22 page ![]() Data Sheet ADV7481 ABSOLUTE MAXIMUM RATINGS Table 6. Parameter Rating TVDD, DVDDIO to GND 4 V AVDD, PVDD, MVDD, DVDD, CVDD to GND 2.2 V CVDD to DVDD −0.3 V to +0.3 V MVDD to DVDD −0.3 V to +0.3 V PVDD to DVDD −0.3 V to +0.3 V AVDD to DVDD −0.3 V to +0.3 V Digital Inputs Voltage to GND GND − 0.3 V to DVDDIO + 0.3 V Digital Outputs Voltage to GND GND − 0.3 V to DVDDIO + 0.3 V Analog Inputs to GND −0.3 V to AVDD + 0.3 V XTALN and XTALP to GND −0.3 V to PVDD + 0.3 V HDMI/MHL Digital Inputs Voltage to GND −0.3 V to CVDD + 0.3 V 5 V Tolerant Inputs Voltage to GND1, 2 −0.3 V to +5.5 V Maximum Junction Temperature (TJ max) 125°C Storage Temperature Range −65°C to +150°C Infrared Reflow Soldering (20 sec) 260°C 1 The following inputs are 3.3 V inputs but are 5 V tolerant: DDC_SCL/CD_PULLUP, DDC_SDA, HPD/CBUS, RX_5V/VBUS, CD_SENSE and CEC. 2 The following inputs are 1.8 V inputs but are 5 V tolerant: DIAG1, DIAG2, DIAG3, and DIAG4. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. THERMAL RESISTANCE To reduce power consumption when using the ADV7481, turn off unused sections of the device. Due to printed circuit board (PCB) metal variation, and, therefore, variation in PCB heat conductivity, the value of θJA may differ for various PCBs. The most efficient measurement solution is achieved using the package surface temperature to estimate the die temperature. This eliminates the variance associated with the θJA value. Do not exceed the maximum junction temperature (TJ max) of 125°C. The following equation calculates the junction temperature (TJ) using the measured package surface temperature and applies only when no heat sink is used on the device under test (DUT): TJ = TS + (ΨJT ×WTOTAL) where: TS is the package surface temperature (°C). ΨJT = 0.81°C/W for the 100-ball CSP_BGA (based on 2s2p test board defined by JEDEC standards. WTOTAL = (PVDD × IPVDD) + (TVDD × ITVDD) − PUpStream + (CVDD × ICVDD) + (AVDD × IAVDD) + (DVDD × IDVDD) + (DVDDIO × IDVDDIO) + (MVDD × IMVDD) where PUpStream is the quantity of TVDD power consumed on the upstream HDMI or MHL transmitter. PUpStream can be estimated to be around 110 mW for a nominal HDMI transmitter. PUpStream can be estimated to be around 42.82 mW for a nominal MHL transmitter. ESD CAUTION Rev. 0 | Page 13 of 22 |
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