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MMRF1314GS датащи(PDF) 3 Page - NXP Semiconductors

номер детали MMRF1314GS
подробное описание детали  RF Power LDMOS Transistors
PDF  17 Pages
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производитель  NXP [NXP Semiconductors]
домашняя страница  http://www.nxp.com
Logo NXP - NXP Semiconductors

MMRF1314GS датащи(HTML) 3 Page - NXP Semiconductors

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MMRF1314H MMRF1314HS MMRF1314GS
3
RF Device Data
NXP Semiconductors
Table 4. Electrical Characteristics (TA =25°C unless otherwise noted) (continued)
Characteristic
Symbol
Min
Typ
Max
Unit
Functional Tests (1,2) (In NXP Narrowband Production Test Fixture, 50 ohm system) VDD =50 Vdc, IDQ(A+B) = 100 mA, Pout = 1000 W Peak
(100 W Avg.), f = 1400 MHz, 128 μsec Pulse Width, 10% Duty Cycle
Power Gain
Gps
16.0
17.7
19.5
dB
Drain Efficiency
ηD
46.0
52.1
%
Input Return Loss
IRL
–18
–9
dB
Load Mismatch/Ruggedness (In NXP Narrowband Test Fixture, 50 ohm system) IDQ(A+B) = 100 mA
Frequency
(MHz)
Signal
Type
VSWR
Pin
(W)
Test Voltage, VDD
Result
1400
Pulse
(128 μsec,
10% Duty Cycle)
> 20:1 at all Phase Angles
31.6 Peak
(3 dB Overdrive)
52
No Device Degradation
Table 5. Ordering Information
Device
Tape and Reel Information
Package
MMRF1314HR5
R5 Suffix = 50 Units, 56 mm Tape Width, 13--inch Reel
NI--1230H--4S, Eared
MMRF1314HSR5
NI--1230S--4S, Earless
MMRF1314GSR5
NI--1230GS--4L, Gull Wing
1. Measurement made with device in push--pull configuration.
2. Measurements made with device in straight lead configuration before any lead forming operation is applied. Lead forming is used for gull
wing (GS) parts.



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