FN9025 Rev 9.00

Page 1 of 13

November 12, 2015

FN9025

Rev 9.00

November 12, 2015

HIP2101

100V/2A Peak, Low Cost, High Frequency Half Bridge Driver

DATASHEET

The HIP2101 is a high frequency, 100V Half Bridge

N-Channel power MOSFET driver IC. It is equivalent to the

HIP2100 with the added advantage of full TTL/CMOS

compatible logic input pins. The low-side and high-side gate

drivers are independently controlled and matched to 13ns.

This gives users total control over dead-time for specific

power circuit topologies. Undervoltage protection on both

the low-side and high-side supplies force the outputs low. An

on-chip diode eliminates the discrete diode required with

other driver ICs. A new level-shifter topology yields the low-

power benefits of pulsed operation with the safety of DC

operation. Unlike some competitors, the high-side output

returns to its correct state after a momentary undervoltage of

the high-side supply.

Features

• Drives N-Channel MOSFET Half Bridge

• SOIC, EPSOIC, QFN and DFN Package Options

• SOIC, EPSOIC and DFN Packages Compliant with 100V

Conductor Spacing Guidelines of IPC-2221

• Pb-free Product Available (RoHS Compliant)

• Bootstrap Supply Max Voltage to 114VDC

• On-Chip 1

 Bootstrap Diode

• Fast Propagation Times for Multi-MHz Circuits

• Drives 1000pF Load with Rise and Fall Times Typ. 10ns

• TTL/CMOS Input Thresholds Increase Flexibility

• Independent Inputs for Non-Half Bridge Topologies

• No Start-Up Problems

• Outputs Unaffected by Supply Glitches, HS Ringing Below

Ground, or HS Slewing at High dv/dt

• Low Power Consumption

• Wide Supply Range

• Supply Undervoltage Protection

•3

 Output Driver Resistance

• QFN/DFN Package:

- Compliant to JEDEC PUB95 MO-220

QFN - Quad Flat No Leads - Package Outline

- Near Chip Scale Package footprint, which improves

PCB efficiency and has a thinner profile

Applications

• Telecom Half Bridge Power Supplies

• Avionics DC-DC Converters

• Two-Switch Forward Converters

• Active Clamp Forward Converters

Ordering Information

PART NUMBER

TEMP.

RANGE (°C)

PACKAGE

PKG.

DWG. #

HIP2101IB (No

longer available,

recommended

replacement:

HIP2101IBZ)

-40 to 125

8 Ld SOIC

M8.15

HIP2101IBZ (Note 1)

-40 to 125

8 Ld SOIC (Pb-free) M8.15

HIP2101EIB (No

longer available,

recommended

replacement:

HIP2101EIBZ)

-40 to 125

8 Ld EPSOIC

M8.15C

HIP2101EIBZ

(Note 1)

-40 to 125

8 Ld EPSOIC

(Pb-free)

M8.15C

HIP2101IRZ (Note 1)

-40 to 125

16 Ld 5x5 QFN

(Pb-free)

L16.5x5

HIP2101IR4Z

(Note 1)

-40 to 125

12 Ld 4x4 DFN

(Pb-free)

L12.4x4A

NOTES:

1. Intersil Pb-free products employ special Pb-free material sets;

molding compounds/die attach materials and 100% matte tin

plate termination finish, which are RoHS compliant and

compatible with both SnPb and Pb-free soldering operations.

Intersil Pb-free products are MSL classified at Pb-free peak reflow

temperatures that meet or exceed the Pb-free requirements of

IPC/JEDEC J STD-020C.

2. Add “T” suffix for Tape and Reel packing option.