AM3351 datasheet(92/252 Pages) TI1

92 / 252 page

AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351

SPRS717J – OCTOBER 2011 – REVISED APRIL 2016

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Product Folder Links: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352 AM3351

Specifications

(1)

These values are based on a JEDEC-defined 2S2P system (with the exception of the theta JC [RΘJC] value, which is based on a

JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these

EIA/JEDEC standards:

•

JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)

•

JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

•

JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

•

JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements

Power dissipation of 2 W and an ambient temperature of 70ºC is assumed.

(2)

°C/W = degrees Celsius per watt.

(3)

m/s = meters per second.

5.8

Thermal Resistance Characteristics for ZCE and ZCZ Packages

Failure to maintain a junction temperature within the range specified in Section 5.5 reduces operating

lifetime, reliability, and performance—and may cause irreversible damage to the system. Therefore, the

product design cycle should include thermal analysis to verify the maximum operating junction

temperature of the device. It is important this thermal analysis is performed using specific system use

cases and conditions. TI provides an application report to aid users in overcoming some of the existing

challenges of producing a good thermal design. For more information, see AM335x Thermal

Considerations.

Table 5-12 provides thermal characteristics for the packages used on this device.

NOTE

Table 5-12 provides simulation data and may not represent actual use-case values.

Table 5-12. Thermal Resistance Characteristics (PBGA Package) [ZCE and ZCZ]

ZCE (°C/W)(1)

(2)

ZCZ (°C/W)(1)

(2)

AIR FLOW

(m/s)(3)

RΘJC

Junction-to-case

10.3

10.2

N/A

RΘJB

Junction-to-board

11.6

12.1

N/A

RΘJA

Junction-to-free air

24.7

24.2

20.5

20.1

1.0

19.7

19.3

2.0

19.2

18.8

3.0

φJT

Junction-to-package top

0.4

0.3

0.0

0.6

1.0

0.7

2.0

0.9

0.8

3.0

φJB

Junction-to-board

11.9

12.7

0.0

11.7

12.3

1.0

11.7

12.3

2.0

11.6

12.2

3.0

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