MP5021 datasheet(3/19 Pages) MPS

3 / 19 page

MP5021 – 12V, 7

mΩ RDSon HOT-SWAP PROTECTION DEVICE

MP5021 Rev. 1.1

www.MonolithicPower.com

1/30/2013

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number*

Package

Top Marking

MP5021GQV

QFN22 (3×5mm)

MP5021

For Tape & Reel, add suffix –Z (e.g. MP5021GQV–Z)

PACKAGE REFERENCE

TIMER

VIN

OUT

AUTO

ISET

FLTB

IMON

OUT

GND

VIN

ENTM

VIN

EXPOSED PAD

VIN

ABSOLUTE MAXIMUM RATINGS (1)

VIN ..................................................-0.3V to 36V

OUT, PD .........................................-0.3V to 20V

EN, FLTB, PG, ISET, TIMER, IMON, SS, AUTO,

ENTM, FB

(2)..................................-0.3V to 6.5V

Continuous Power Dissipation (TA = +25°C)

(3)

............................................................. 2.7W

Power Dissipation (TA = +25°C, 10ms Single

Pulse)

............................................................ 215W

Maximum Current (TA = +25°C)

............................................................... 25A

Storage Temperature............... -65°C to +155°C

Operating Temperature............ -40°C to +150°C

Recommended Operating Conditions

(4)

Input Voltage Operating Range ......... 8V to 16V

Operating Junction Temp. (TJ). -40°C to +125°C

Thermal Resistance

(5)

θJA

θJC

QFN22 ....................................46 ...... 10 ... °C/W

Notes:

1) Exceeding these ratings may damage the device..

2) Maximum Input Voltage to be≤6.0V if Vcc ≥ 6.0V. Maximum

Input Voltage to be Vcc if Vcc ≤ 6.0V.

3) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX)-TA)/θJA. Exceeding the maximum allowable power

dissipation will cause excessive die temperature, and the

regulator will go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

4) The device is not guaranteed to function outside of its

operating conditions.

5) Measured on JESD51-7 4-layer board.

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