4100 datasheet(35/43 Pages) CYPRESS

35 / 43 page

Document Number: 001-87220 Rev. *J

Page 35 of 43

PSoC® 4: PSoC 4100 Family

Datasheet

Packaging

PSoC 4 CAB Libraries with Schematics Symbols and PCB Footprints are on the Cypress web site at

http://www.cypress.com/cad-resources/psoc-4-cad-libraries?source=search&cat=technical_documents.

Table 40. Package Characteristics

Parameter

Description

Conditions

Min

Typ

Max

Units

Operating ambient temperature

–40

25.00

105

°C

Operating junction temperature

–40

–

125

°C

TJA

Package

JA (28-pin SSOP)

–

66.58

–

°C/Watt

TJA

Package

JA (35-ball WLCSP)

–

28.00

–

°C/Watt

TJA

Package

JA (40-pin QFN)

–

15.34

–

°C/Watt

TJA

Package

JA (44-pin TQFP)

–

57.16

–

°C/Watt

TJA

Package

JA (48-pin TQFP)

–

67.30

–

°C/Watt

TJC

Package

JC (28-pin SSOP)

–

26.28

–

°C/Watt

TJC

Package

JC (35-ball WLCSP)

–

00.40

–

°C/Watt

TJC

Package

JC (40-pin QFN)

–

2.50

–

°C/Watt

TJC

Package

JC (44-pin TQFP)

–

17.47

–

°C/Watt

TJC

Package

JC (48-pin TQFP)

–

27.60

–

°C/Watt

Table 41. Solder Reflow Peak Temperature

Package

Maximum Peak

Temperature

Maximum Time at Peak Temperature

28-pin SSOP

260 °C

30 seconds

35-ball WLCSP

260 °C

30 seconds

40-pin QFN

260 °C

30 seconds

44-pin TQFP

260 °C

30 seconds

48-pin TQFP

260 °C

30 seconds

Table 42. Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-2

Package

MSL

28-pin SSOP

MSL 3

35-ball WLCSP

MSL 3

40-pin QFN

MSL 3

44-pin TQFP

MSL 3

48-pin TQFP

MSL 3

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