Pad Coordinates

Unit:

mm

Pad No.

X

Y

Pad No.

X

Y

1

-939.550

1222.175

16

899.200

-965.126

2

-939.550

1111.575

17

899.200

-287.274

3

-939.550

1011.575

18

938.800

-100.675

4

-939.550

900.975

19

938.800

9.925

5

-939.550

800.975

20

938.800

109.925

6

-939.550

690.375

21

938.800

220.525

7

-939.550

590.375

22

-26.300

1336.775

8

-939.550

479.775

23

-136.900

1336.775

9

301.450

-1303.400

24

-236.900

1336.775

10

413.250

-1303.400

25

-347.500

1336.775

11

526.890

-1303.400

26

-447.500

1336.775

12

636.250

-1303.400

27

-558.100

1336.775

13

761.700

-1296.750

28

-658.100

1336.775

14

924.250

-1296.750

29

-768.700

1336.775

15

899.200

-1078.450

Pad Description

Pad Name

I/O

Internal

Connection

Function

PB0~PB7

I/O

Pull-High

or None

Bidirectional 8-bit Input/Output port

AUD

O

¾

Audio output for driving a external transistor or for driving HT82V733

TEST

¾¾

No connection (open)

VDDA

¾¾

DAC power supply

VDD

¾¾

Positive power supply

VSSA

¾¾

Negative power supply of DAC, ground

VSS

¾¾

Negative power supply, ground

RES

I

¾

Reset input, active low

OSC1

OSC2

I

O

¾

OSC1 and OSC2 are connected to an RC network or a crystal (by mask option)

for the internal system clock. In the case of RC operation, OSC2 is the output

terminal for 1/8 system clock. The system clock may come from the crystal, the

two pins cannot be floating.

PC0~PC3

I/O

Pull-High

or None

Bidirectional 4-bit Input/Output port

PA0~PA7

I/O

Pull-High

or None

Bidirectional 8-bit Input/Output port, wake-up by mask option

Absolute Maximum Ratings

Storage Temperature ...........................

-50°Cto125°C

Operating Temperature ..........................

-25°Cto70°C

Note: These are stress ratings only. Stresses exceeding the range specified under

²Absolute Maximum Ratings² may

cause substantial damage to the device. Functional operation of this device at other conditions beyond those

listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliabil-

ity.

HT36A2

Rev. 1.00

3

June 19, 2003