AD9237

Data Sheet

Rev. C | Page 8 of 24

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

NOTES

1. DNC = DO NOT CONNECT.

2. IT IS RECOMMENDED THAT THE EXPOSED PADDLE

BE SOLDERED TO THE GROUND PLANE.

MODE2

CLK

OE

PDWN

GC

DNC

D0 (LSB)

D1

VREF

SENSE

MODE

OTR

D11 (MSB)

D10

D9

D8

1

2

3

4

5

6

7

8

24

23

22

21

20

19

18

17

AD9237

TOP VIEW

(Not to Scale)

Figure 3. Pin Configuration

Table 6. Pin Function Descriptions

Pin Number

Mnemonic

Description

1

MODE2

SHA Gain Select and Power Scaling Control (see Table 8).

2

CLK

Clock Input Pin.

3

OE

Output Enable Pin (Active Low).

4

PDWN

Power-Down Function Selection (see Table 9).

5

GC

Gray Code Control (Active High).

6

DNC

Do Not Connect.

7 to 14, 17 to 20

D0 (LSB) to D11 (MSB)

Data Output Bits.

15

DGND

Digital Output Ground.

16

DRVDD

Digital Output Driver Supply. Must be decoupled to DGND with a minimum 0.1 μF capacitor.

Recommended decoupling is 0.1 μF in parallel with 10 μF.

21

OTR

Out-of-Range Indicator.

22

MODE

Data Format and Clock Duty Cycle Stabilizer (DCS) Mode Selection (see Table 10).

23

SENSE

Reference Mode Selection (see Table 7).

24

VREF

Voltage Reference Input/Output (see Table 7).

25

REFB

Differential Reference (−). Must be decoupled to REFT with a minimum 10 μF capacitor.

26

REFT

Differential Reference (+).

27, 32

AVDD

Analog Power Supply. Must be decoupled to AGND with a minimum 0.1 μF capacitor.

Recommended decoupling is 0.1 μF in parallel with 10 μF.

28, 31

AGND

Analog Ground.

29

VIN+

Analog Input Pin (+).

30

VIN−

Analog Input Pin (−).

EP

It is recommended that the exposed paddle be soldered to the ground plane. There is an

increased reliability of the solder joints and maximum thermal capability of the package is

achieved with exposed paddle soldered to the customer board.