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T0504SP датащи(PDF) 2 Page - Chip Integration Technology Corporation

номер детали T0504SP
подробное описание детали  Ultra-Low Capacitance ESD Protection Device
PDF  8 Pages
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производитель  CITC [Chip Integration Technology Corporation]
домашняя страница  http://www.citcorp.com.tw/english/index.php
Logo CITC - Chip Integration Technology Corporation

T0504SP датащи(HTML) 2 Page - Chip Integration Technology Corporation

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Absolute Maximum Rating
Symbol
Parameter
Value
Units
VESD
ESD per IEC 61000-4-2 (Air)
ESD per IEC 61000-4-2 (Contact)
±
25
±
17
kV
TOPT
Operating Temperature
-55/+125
o
C
TSTG
Storage Temperature
-55/+150
C
Electrical Characteristics (T = 25 C)
Symbol
Parameter
VRWM
Nominal Reverse Working Voltage
IR
Reverse Leakage Current @VRWM
VBR
Reverse Breakdown Voltage @I T
IT
Test Current for Reverse Breakdown
VC
Clamping Voltage @ IPP
IPP
Maximum Peak Pulse Current
CESD
Parasitic Capacitance
VR
Reverse Voltage
f
Small Signal Frequency
IF
Forward Current
VF
Forward Voltage @IF
Symbol
Test Condition
Minimum
Typical
Maximum
Units
VRWM
5.0
V
IR
V
= 5V,T = 25
RWM
C
Between I/O and GND
0.1
1.0
μA
VBR
IT = 1mA
Between I/O and GND
7.0
9.0
11.0
V
VC
IPP = 1A, tp= 8/20μs
Between I/O and GND
12
V
CESD
VR = 0V, f = 1MHz
Between I/O and GND
pF
CESD
VR = 0V, f = 1MHz
Between I/O and I/O
pF
0.2
0.2
o
o
Ultra-Low Capacitance ESD Protection Device
Chip Integration Technology Corporation
T0504SP
V
I
VRWM
VBR
VC
IPP
IR
IT
VRWM VBR VC
IPP
IR
IT
Bi-Directional TVS
Document ID : DS-22V15
Revised Date : 2017/07/20
Revision : C



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