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SSD30N02 датащи(PDF) 2 Page - SeCoS Halbleitertechnologie GmbH |
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SSD30N02 датащи(HTML) 2 Page - SeCoS Halbleitertechnologie GmbH |
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2 / 4 page ![]() Elektronische Bauelemente SSD30N02 30A, 20V, RDS(ON) 21 m N-Ch Enhancement Mode Power MOSFET 29-Apr-2016 Rev. A Page 2 of 4 http://www.SeCoSGmbH.com/ Any changes of specification will not be informed individually. ELECTRICAL CHARACTERISTICS (T J=25°C unless otherwise specified) Parameter Symbol Min. Typ. Max. Unit Test Condition Drain-Source Breakdown Voltage BVDSS 20 - - V VGS=0, ID=250µA - - 1 VDS=16V, VGS=0, TJ=25°C Drain-Source Leakage Current IDSS - - 30 µA VDS=16V, VGS=0, TJ=85°C Gate-Source Leakage Current IGSS - - ±100 nA VDS=0V, VGS= ±12V Gate-Threshold Voltage VGS(th) 0.5 0.7 1 V VDS=VGS, ID=250µA - 16 21 VGS=4.5V, ID=10A Static Drain-Source On-Resistance 2 RDS(ON) - 21 26 m VGS=2.5V, ID=5A Input Capacitance Ciss - 600 - Output Capacitance Coss - 100 - Reverse Transfer Capacitance Crss - 72 - pF VDS=10V VGS=0 f=1MHz Total Gate Charge Qg - 6.5 - Gate-Source Charge Qgs - 0.9 - Gate-Drain (“Miller”) Charge Qgd - 2 - nC VDS=10V VGS=4.5V ID=15A Turn-on Delay Time Td(on) - 8.5 - Rise Time Tr - 13 - Turn-off Delay Time Td(off) - 23.5 - Fall Time Tf - 4 - nS VDD=10V VGS=10V RG=6 RL=10 ID=1A Source-Drain Diode Characteristics Diode Forward Voltage 2 VSD - - 1.2 V IS=1.3A, VGS=0V Continuous Source Current 1,4 IS - - 30 A Pulsed Source Current 2,4 ISM - - 40 A VG=VD=0V, Force Current Reverse Recovery Time TRR - 9 - nS Reverse Recovery Charge QRR - 3 - nC IF=8A , dI/dt=100A/µs, TJ=25°C Notes: 1. The data is tested when the surface of the device is mounted on a 1 inch 2 FR-4 board with 2OZ copper. 2. The data is tested by the pulse: Pulse width≦300µs, duty cycle≦2%. 3. The power dissipation is limited by 150°C juncti on temperature. 4. The data is theoretically the same as ID and IDM, in real applications, the data should be limited by the total power dissipation. |
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