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MPXM2102AS датащи(PDF) 331 Page - Motorola, Inc |
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MPXM2102AS датащи(HTML) 331 Page - Motorola, Inc |
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331 / 670 page ![]() MPXV6115VC6U 3–185 Motorola Sensor Device Data www.motorola.com/semiconductors Figure 2. Cross Sectional Diagram SOP (Not to Scale) Figure 3. Typical Application Circuit (Output Source Current Operation) VS Pin 2 +5.0 V GND Pin 3 Vout Pin 4 MPXV6115VC6U to ADC 100 nF 51 K 47 pF FLUOROSILICONE GEL DIE COAT WIRE BOND DIFFERENTIAL SENSING ELEMENT THERMOPLASTIC CASE STAINLESS STEEL CAP LEAD FRAME P1 P2 DIE BOND DIE Figure 2 illustrates the absolute sensing chip in the basic Small Outline chip carrier (Case 482). Figure 3 shows a typical application circuit (output source current operation). Figure 4. Output versus Absolute Pressure MAX TRANSFER FUNCTION: Vout = VS*[(0.007652*P) + 0.92] ± (Pressure error *Temp Factor*0.007652*VS) VS = 5.0 V ± 0.25 Vdc TEMP = 0–85 ° C MIN –115 –95 –75 –55 –35 –15 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 Vout vs. VACUUM TRANSFER FUNCTION MPXV6115VC6U 0 Figure 4 shows the sensor output signal relative to pres- sure input. Typical minimum and maximum output curves are shown for operation over 0 to 85 °C temperature range. The output will saturate outside of the rated pressure range. A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPXV6115VC6U pressure sensor operating characteristics, internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long–term reliability. Contact the factory for information regarding me- dia compatibility in your application. Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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