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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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MPXM2102AS датащи(PDF) 328 Page - Motorola, Inc |
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MPXM2102AS датащи(HTML) 328 Page - Motorola, Inc |
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328 / 670 page  MPXV5004G SERIES 3–182 Motorola Sensor Device Data www.motorola.com/semiconductors PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The Motorola pressure sensor is designed to operate with positive differential pres- sure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Part Number Case Type Pressure (P1) Side Identifier MPXV5004GC6U/T1 482A Side with Port Attached MPXV5004G6U/T1 482 Stainless Steel Cap MPXV5004GC7U 482C Side with Port Attached MPXV5004G7U 482B Stainless Steel Cap MPXV5004GP 1369 Side with Port Attached MPXV5004DP 1351 Side with Port Marking MPXV5004GVP 1368 Stainless Steel Cap ORDERING INFORMATION MPXV5004G series pressure sensors are available in the basic element package or with a pressure port. Two packing options are offered for the surface mount configuration. Device Type / Order No Case No Packing Options Device Marking Device Type / Order No. Case No. Packing Options Device Marking MPXV5004G6U 482 Rails MPXV5004G MPXV5004G6T1 482 Tape and Reel MPXV5004G MPXV5004GC6U 482A Rails MPXV5004G MPXV5004GC6T1 482A Tape and Reel MPXV5004G MPXV5004GC7U 482C Rails MPXV5004G MPXV5004G7U 482B Rails MPXV5004G MPXV5004GP 1369 Trays MPXV5004G MPXV5004DP 1351 Trays MPXV5004G MPXV5004GVP 1368 Trays MPXV5004G INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482) MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection inter- face between the board and the package. With the correct fottprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and short- ing between solder pads. 0.660 16.76 0.060 TYP 8X 1.52 0.100 TYP 8X 2.54 0.100 TYP 8X 2.54 0.300 7.62 Figure 5. SOP Footprint (Case 482) inch mm SCALE 2:1 Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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