MPXM2102AS datasheet(323/670 Pages) MOTOROLA

номер детали	MPXM2102AS

подробное описание детали	Sensor

PDF	670 Pages

Scroll/Zoom	100%

производитель	MOTOROLA [Motorola, Inc]

домашняя страница	http://www.freescale.com

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323 / 670 page

MPXV4115V SERIES

3–177

Motorola Sensor Device Data

www.motorola.com/semiconductors

ORDERING INFORMATION

The MPXV4115V series pressure sensors are available in the basic element package or with a pressure port. Two packing

options are also offered.

Device Type

Case No

Packing Options

Device Marking

Device Type

Case No.

Packing Options

Device Marking

MPXV4115V6U

482

Rails

MPXV4115V

MPXV4115V6T1

482

Tape and Reel

MPXV4115V

MPXV4115VC6U

482A

Rails

MPXV4115V

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the surface mount packages must

be the correct size to ensure proper solder connection inter-

face between the board and the package. With the correct

fottprint, the packages will self align when subjected to a

solder reflow process. It is always recommended to design

boards with a solder mask layer to avoid bridging and short-

ing between solder pads.

0.660

16.76

0.060 TYP 8X

1.52

0.100 TYP 8X

2.54

0.100 TYP 8X

2.54

0.300

7.62

Figure 5. SOP Footprint (Case 482)

inch

SCALE 2:1

Freescale Semiconductor, Inc.

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