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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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MPXM2102AS датащи(PDF) 319 Page - Motorola, Inc |
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MPXM2102AS датащи(HTML) 319 Page - Motorola, Inc |
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319 / 670 page  MPXV4006G SERIES 3–173 Motorola Sensor Device Data www.motorola.com/semiconductors PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The Motorola pres- sure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Part Number Case Type Pressure (P1) Side Identifier MPXV4006G6U/T1 482 Stainless Steel Cap MPXV4006GC6U/T1 482A Side with Port Attached MPXV4006G7U 482B Stainless Steel Cap MPXV4006GC7U 482C Side with Port Attached MPXV4006GP 1369 Side with Port Attached MPXV4006DP 1351 Side with Part Marking ORDERING INFORMATION MPXV4006G series pressure sensors are available in the basic element package or with pressure ports. Two packing options are offered for the 482 and 482A case configurations. Device Type Options Case No. MPX Series Order No. Packing Options Marking Basic Element Element Only 482 MPXV4006G6U Rails MPXV4006G Element Only 482 MPXV4006G6T1 Tape and Reel MPXV4006G Element Only 482 MPXV4006G7U Rails MPXV4006G Ported Element Axial Port 482A MPXV4006GC6U Rails MPXV4006G Axial Port 482A MPXV4006GC6T1 Tape and Reel MPXV4006G Axial Port 482A MPXV4006GC7U Rails MPXV4006G Side Port 1369 MPXV4006GP Trays MPXV4006G Dual Port 1351 MPXV4006DP Trays MPXV4006G MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection inter- face between the board and the package. With the correct footprint, the packages will self align when subjected to a sol- der reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and short- ing between solder pads. 0.660 16.76 0.060 TYP 8X 1.52 0.100 TYP 8X 2.54 0.100 TYP 8X 2.54 0.300 7.62 Figure 5. SOP Footprint (Case 482) inch mm SCALE 2:1 Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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