MPXM2010GS datasheet(218/670 Pages) MOTOROLA

218 / 670 page

MPX4101A MPXA4101A MPXH6101A SERIES

3–72

Motorola Sensor Device Data

www.motorola.com/semiconductors

Figure 2. Cross Sectional Diagram SSOP

(not to scale)

WIRE BOND

STAINLESS

STEEL CAP

THERMOPLASTIC

CASE

DIE BOND

SEALED VACUUM REFERENCE

DIE

FLUORO SILICONE

GEL DIE COAT

LEAD

FRAME

ABSOLUTE ELEMENT

Figure 2 illustrates an absolute sensing chip in the super small outline package (Case 1317).

5.0

4.5

4.0

3.5

3.0

Pressure (ref: to sealed vacuum) in kPa

TYP

MAX

MIN

2.5

2.0

1.5

1.0

0.5

TRANSFER FUNCTION:

Vout = Vs* (PX0.01059*P–0.10941) ± Error

Figure 3. Recommended power supply decoupling

and output filtering.

Figure 4. Output versus Absolute Pressure

VS = 5.1 Vdc

TEMP = 0 to 85

°C

20 kPa TO 105 kPa

MPX4101A

VS Pin 2

+5.1 V

GND Pin 3

Vout Pin 4

to ADC

100 nF

51 K

47 pF

MPXH6101A

Figure 4 shows the sensor output signal relative to pres-

sure input. Typical, minimum, and maximum output curves

are shown for operation over a temperature range of 0

° to

°C. The output will saturate outside of the specified pres-

sure range.

A fluorosilicone gel isolates the die surface and wire

bonds from the environment, while allowing the pressure

signal to be transmitted to the sensor diaphragm. The

MPX4101A/MPXA4101A/MPXH6101A series pressure sen-

sor operating characteristics, and internal reliability and qual-

ification tests are based on use of dry air as the pressure

media. Media, other than dry air, may have adverse effects

on sensor performance and long–term reliability. Contact the

factory for information regarding media compatibility in your

application.

Figure 3 shows the recommended decoupling circuit for

interfacing the output of the integrated sensor to the A/D in-

put of a microprocessor or microcontroller. Proper decoup-

ling of the power supply is recommended.

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

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