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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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MPXM2010GS датащи(PDF) 220 Page - Motorola, Inc |
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MPXM2010GS датащи(HTML) 220 Page - Motorola, Inc |
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220 / 670 page  MPX4101A MPXA4101A MPXH6101A SERIES 3–74 Motorola Sensor Device Data www.motorola.com/semiconductors PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluorosilicone gel which protects the die from harsh media. The Motorola pres- sure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Part Number Case Type Pressure (P1) Side Identifier MPX4101A 867 Stainless Steel Cap MPXA4101AC6U 482A Side with Port Attached MPXH6101A6U 1317 Stainless Steel Cap MPXH6101A6T1 1317 Stainless Steel Cap ORDERING INFORMATION — UNIBODY PACKAGE The MPX4101A series MAP silicon pressure sensors are available in the Basic Element, or with pressure port fittings that provide mounting ease and barbed hose connections. MPX Series Device Type Options Case Type Order Number Device Marking Basic Element Absolute, Element Only 867 MPX4101A MPX4101A ORDERING INFORMATION — SMALL OUTLINE PACKAGE Device Type Options Case No. MPX Series Order No. Packing Options Marking Ported Element Absolute, Axial Port 482A MPXA4101AC6U Rails MPXA4101A ORDERING INFORMATION — SUPER SMALL OUTLINE PACKAGE Device Type Options Case No. MPX Series Order No. Packing Options Marking Basic Element Absolute, Element Only 1317 MPXH6101A6U Rails MPXH6101A Basic Element Absolute, Element Only 1317 MPXH6101A6T1 Tape and Reel MPXH6101A INFORMATION FOR USING THE SMALL OUTLINE PACKAGES MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection inter- face between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and short- ing between solder pads. 0.660 16.76 0.060 TYP 8X 1.52 0.100 TYP 8X 2.54 0.100 TYP 8X 2.54 0.300 7.62 Figure 5. SOP Footprint (Case 482) inch mm SCALE 2:1 Figure 6. SSOP Footprint (Case 1317) 0.027 TYP 8X 0.69 0.053 TYP 8X 1.35 inch mm 0.387 9.83 0.150 3.81 0.050 1.27 TYP Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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