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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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MPXM2010GS датащи(PDF) 215 Page - Motorola, Inc |
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MPXM2010GS датащи(HTML) 215 Page - Motorola, Inc |
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215 / 670 page  MPX4100A MPXA4100A SERIES 3–69 Motorola Sensor Device Data www.motorola.com/semiconductors INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482) MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection inter- face between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and short- ing between solder pads. 0.660 16.76 0.060 TYP 8X 1.52 0.100 TYP 8X 2.54 0.100 TYP 8X 2.54 0.300 7.62 inch mm SCALE 2:1 Figure 5. SOP Footprint (Case 482) Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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