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ZSSC3170 датащи(PDF) 2 Page - Integrated Device Technology

номер детали ZSSC3170
подробное описание детали  Automotive Sensor Signal Conditioner with LIN and PWM Interface
PDF  30 Pages
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производитель  IDT [Integrated Device Technology]
домашняя страница  http://www.idt.com
Logo IDT - Integrated Device Technology

ZSSC3170 датащи(HTML) 2 Page - Integrated Device Technology

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Automotive Sensor Signal Conditioner
with LIN and PWM Interface
ZSSC3170
Datasheet
© 2016 Integrated Device Technology, Inc.
2
May 30, 2016
May 27, 2016
Analog Front-End (AFE)
Digital Block
Interfaces
Ext. Temp.
Diode
Sensor
Bridge
Temp. Sens.
Select
Gain
Factor
Offset
Shift
ADC
Mode
HOUT
LOUT
LIN
Internal
Temp.
Sensor
PGA
ADC
EEPROM
CMC
RAM
I
2CTM*
PWM
LIN
Protection &
Power
Management
SCL
SDA
VB
VSSE
Control Registers
VTN2
VTN1
VBR_B
VBR_T
VBN
VBP
ZSSC3170
VDDA
VSSA
MUX
ZSSC3170
Block Diagram
* I
2C™ is a trademark of NXP.
Applications
LIN Pressure Sensor with Temperature Sensor
Sensor Bridge
With Integrated
Temperature Diode
SDA
SCL
12
11
13
14
16
15
17
18
9
10
5
6
4
3
LIN
LOUT
n.c.
VBN
VBR_B
VBP
VTN 1
VBR_T
VSS
VSSE
VB
HOUT
VDD
SCL
SDA
VSSA
20
19
1
2
VTN2
n.c.
VDDA
7
8
R1
10
W
LIN
VBAT
GND
C2
220nF
C3
220pF
C1
100nF
R2
RTD Media
Temperature
Sensor
n.c.
Ordering Information (See section 7 in the data sheet for additional options.)
Product Sales Code
Description
Package
ZSSC3170FE1B
ZSSC3170 Die Revision F
— Temperature range: -40°C to +150°C
Unsawn on Wafer, 2450 pcs.
ZSSC3170FE1C
ZSSC3170 Die Revision F
— Temperature range: -40°C to +150°C
Sawn on Wafer Frame, 2450 pcs.
ZSSC3170FE2
ZSSC3170 SSOP20 Revision F
— Temperature range: -40°C to +150°C
Add R for
13” reel, 2000 pcs. Add T for tube, 660 pcs.
ZSSC3170EE1B
ZSSC3170 Die Revision E
— Temperature range: -40°C to +150°C
Unsawn on Wafer, 2450 pcs.
ZSSC3170EE1C
ZSSC3170 Die Revision E
— Temperature range: -40°C to +150°C
Sawn on Wafer Frame, 2450 pcs.
ZSSC3170EE2
ZSSC3170 SSOP20 Revision E
— Temperature range: -40°C to +150°C
Add R for 13” reel, 2000 pcs. Add T for tube, 660 pcs.
ZSSC3170EE3R
ZSSC3170 DFN20 Revision E
— Temperature Range -40°C to +150°C
13” Reel, 4500 pcs
ZSSC3170EA1B
ZSSC3170 Die Revision E
— Temperature range: -40°C to +125°C
Unsawn on Wafer, 2450 pcs.
ZSSC3170EA1C
ZSSC3170 Die Revision E
— Temperature range: -40°C to +125°C
Sawn on Wafer Frame, 2450 pcs.
ZSSC3170EA3R
ZSSC3170 DFN20 Revision E
— Temperature Range -40°C to +125°C
13” Reel, 4500 pcs
ZSSC3170KIT
ZSSC3170 Evaluation Kit and 5 SSOP20 samples
Kit
.
Corporate Headquarters
6024 Silver Creek Valley
Road
San Jose, CA 95138
www.IDT.com
Sales
1-800-345-7015 or 408-
284-8200
Fax: 408-284-2775
www.IDT.com/go/sales
Tech Support
www.IDT.com/go/support
DISCLAIMER Integrated Device Technology, Inc. (IDT) reserves the right to modify the products and/or specifications described herein at any time, without notice, at
IDT's sole discretion. Performance specifications and operating parameters of the described products are determined in an ind ependent state and are not guaranteed to
perform the same way when installed in customer products. The information contained herein is provided without representation or warran ty of any kind, whether
express or implied, including, but not limited to, the suitability of IDT's products for any particular pur pose, an implied warranty of merchantability, or non-infringement of
the intellectual property rights of others. This document is presented only as a guide and does not convey any license under intellectual property rights of IDT or any
third parties.
IDT's products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or
malfunction of an IDT product can be reasonably expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at
their own risk, absent an express, written agreement by IDT.
Integrated Device Technology, IDT and the IDT logo are trademarks or registered trademarks of IDT and its subsidiaries in the United States and other countries. Other
trademarks used herein are the property of IDT or their respective third party owners. For datasheet type definitions and a g lossary of common terms, visit
www.idt.com/go/glossary. All contents of this document are copyright of Integrated Device Technology, Inc. All rights reserved.



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