HCPL3140 datasheet(5/16 Pages) HP

5 / 16 page

TS – CASE TEMPERATURE – °C

200

600

400

800

75 100

200

150 175

PS (mW)

125

100

300

500

700

IS (mA)

Insulation and Safety Related Specifications

Parameter

Symbol

HCPL-3140

HCPL-0314

Units

Conditions

Minimum External Air Gap

L(101)

7.1

4.9

Measured from input terminals

(Clearance)

to output terminals, shortest

distance through air.

Minimum External Tracking

L(102)

7.4

4.8

Measured from input terminals

(Creepage)

to output terminals, shortest

distance path along body.

Minimum Internal Plastic Gap

0.08

Through insulation distance

(Internal Clearance)

conductor to conductor, usually

the straight line distance

thickness between the emitter

and detector.

Tracking Resistance

CTI

>175

DIN IEC 112/VDE 0303 Part 1

(Comparative Tracking Index)

Isolation Group

IIIa

Material Group (DIN VDE

0110, 1/89, Table 1)

Absolute Maximum Ratings

Parameter

Symbol

Min.

Max.

Units

Note

Storage Temperature

-55

125

°C

Operating Temperature

-40

100

°C

Average Input Current

IF(AVG)

Peak Transient Input Current (<1

µs pulse

IF(TRAN)

1.0

width, 300pps)

Reverse Input Voltage

“High” Peak Output Current

IOH(PEAK)

0.6

“Low” Peak Output Current

IOL(PEAK)

0.6

Supply Voltage

VCC-VEE

-0.5

Output Voltage

VO(PEAK)

-0.5

VCC

Output Power Dissipation

250

Input Power Dissipation

105

Lead Solder Temperature

260

°C for 10 sec., 1.6 mm below seating plane

Solder Reflow Temperature Profile

See Package Outline Drawings section

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