4

Solder Reflow Temperature Profile

Regulatory Information

The HCPL-3140/HCPL-0314 are

pending approval by the

following organizations:

VDE

Approval under VDE 0884/06.92

HCPL-0314.

UL

Approval under UL 1577,

component recognition program

prior to product release. File

E55361.

CSA

Approval under CSA Component

Acceptance Notice #5, File CA

88324 expected prior to product

release.

VDE 0884 Insulation Characteristics (HCPL-3140 Option 060)

Description

Symbol

Characteristic

Unit

Installation classification per DIN VDE 0110/1.89, Table 1

for rated mains voltage

I - IV

for rated mains voltage

I - III

for rated mains voltage

I-II

Climatic Classification

55/100/21

Pollution Degree (DIN VDE 0110/1.89)

2

Maximum Working Insulation Voltage

630

Input to Output Test Voltage, Method b*

1181

Input to Output Test Voltage, Method a*

945

Partial discharge < 5 pC

Highest Allowable Overvoltage

6000

Safety-limiting values - maximum values allowed in the

event of a failure.

Case Temperature

175

°C

Input Current**

230

mA

Output Power**

600

mW

Ω

* Refer to the optocoupler section of the Isolation and Control Components Designer’s Catalog, under Product Safety Regulations section, (VDE

0884) for a detailed description of Method a and Method b partial discharge test profiles.

0

TIME (SECONDS)

200

100

50

150

100

200

250

300

0

30

SEC.

50 SEC.

30

SEC.

160°C

140°C

150°C

PEAK

TEMP.

245°C

PEAK

TEMP.

240°C

PEAK

TEMP.

230°C

SOLDERING

TIME

200°C

PREHEATING TIME

150°C, 90 + 30 SEC.

2.5°C ± 0.5°C/SEC.

3°C + 1°C/–0.5°C

TIGHT

TYPICAL

LOOSE

ROOM

TEMPERATURE

PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.

REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.