3

All Agilent data sheets report the

creepage and clearance inherent

to the optocoupler component

itself. These dimensions are

needed as a starting point for the

equipment designer when deter-

mining the circuit insulation re-

quirements. However, once

mounted on a printed circuit

Regulatory Information

The HCPL-0738 has been

approved by the following

organizations:

UL

Recognized under UL 1577,

component recognition program,

File E55361.

CSA

Approved under CSA Component

Acceptance Notice #5, File

CA88324.

TUV

Approved according to

VDE 0884/06.92, Certificate

R9650938.

board, minimum creepage and

clearance requirements must be

met as specified for individual

equipment standards. For creep-

age, the shortest distance path

along the surface of a printed

circuit board between the solder

fillets of the input and output

leads must be considered. There

are recommended techniques

such as grooves and ribs which

may be used on a printed circuit

board to achieve desired creep-

age and clearances. Creepage and

clearance distances will also

change depending on factors

such as pollution degree and

insulation level.

Insulation and Safety Related Specifications (approval pending)

Parameter

Symbol

Value

Units

Conditions

Minimum External Air Gap

L(I01)

4.9

mm

Measured from input terminals to output terminals,

(Clearance)

shortest distance through air.

Minimum External Tracking

L(I02)

4.8

mm

Measured from input terminals to output terminals,

(Creepage)

shortest distance path along body.

Minimum Internal Plastic Gap

0.08

mm

Insulation thickness between emitter and detector; also

(Internal Clearance)

known as distance through insulation.

Tracking Resistance

CTI

≥ 175

Volts

DIN IEC 112/VDE 0303 Part 1

(Comparative Tracking Index)

Isolation Group

IIIa

Material Group (DIN VDE 0110, 1/89, Table 1)

Absolute Maximum Ratings

Parameter

Symbol

Minimum

Maximum

Units

Storage Temperature

–55

125

˚C

Ambient Operating Temperature

–40

100

˚C

Supply Voltage

0

6.0

Volts

Output Voltage

–0.5

Volts

Average Forward Input Current

—20

mA

Average Output Current

—2

mA

Lead Solder Temperature

260˚C for 10 seconds, 1.6 mm below seating plane

Solder Reflow Temperature Profile

See Solder Reflow Thermal Profile section

Recommended Operating Conditions

Parameter

Symbol

Minimum

Maximum

Units

Ambient Operating Temperature

–40

100

˚C

Supply Voltages

4.5

5.5

V

Input Current (ON)

10

16

mA