Table of Contents

General Description............................................................................................................................................................................................1

Applications........................................................................................................................................................................................................1

Block Diagram....................................................................................................................................................................................................1

Main Features....................................................................................................................................................................................................2

Measurement Modes..........................................................................................................................................................................................2

Readout Modes..................................................................................................................................................................................................2

1. Electrical, optical and timing characteristics.............................................................................................................................................6

1.1. Operating conditions and electrical characteristics...............................................................................................................................6

1.2. Absolute maximum ratings....................................................................................................................................................................7

1.3. Temperature sensor characteristics......................................................................................................................................................7

1.4. Timing parameters.................................................................................................................................................................................7

1.5. Optical characteristics............................................................................................................................................................................8

1.6. TOF and grayscale sensitivity...............................................................................................................................................................8

1.7. Ambient-light / Background-light (BG) suppression..............................................................................................................................8

2. Pin-out.....................................................................................................................................................................................................10

2.1. Pin mapping.........................................................................................................................................................................................10

2.2. Pin list..................................................................................................................................................................................................11

2.3. Power domain separation and ESD protection...................................................................................................................................14

3. Packaging and layout information..........................................................................................................................................................15

3.1. Mechanical dimensions ......................................................................................................................................................................15

3.2. Pin1 marking........................................................................................................................................................................................16

3.3. Location of the photosensitive area.....................................................................................................................................................16

3.4. PCB design and SMD manufacturing process considerations............................................................................................................17

3.5. Soldering and IC handling...................................................................................................................................................................18

4. Ordering Information...............................................................................................................................................................................18

5. Functional Description............................................................................................................................................................................19

5.1. Typical Application Diagram................................................................................................................................................................20

5.2. External Clock......................................................................................................................................................................................24

5.3. Supply, Reset and Start-up Options....................................................................................................................................................25

5.3.1. Supply voltages and external reset..................................................................................................................................................25

5.3.2. Software reset via I2C......................................................................................................................................................................26

5.3.3. Strap pins..........................................................................................................................................................................................26

5.3.4. Start-up (Clock, PLL turn-on and EEPROM copy)...........................................................................................................................26

5.4. I2C Slave.............................................................................................................................................................................................27

5.4.1. Device addressing............................................................................................................................................................................27

5.4.2. I2C bus protocol notation..................................................................................................................................................................27

5.4.3. I2C bus timing...................................................................................................................................................................................28

5.4.4. General calls.....................................................................................................................................................................................29

5.4.5. Write access.....................................................................................................................................................................................29

5.4.6. Read access.....................................................................................................................................................................................29

5.4.7. Control commands............................................................................................................................................................................30

5.4.8. I2C control command examples:......................................................................................................................................................31

5.5. LED driver and DLL.............................................................................................................................................................................33

5.5.1. LED driver.........................................................................................................................................................................................33

5.5.2. DLL (Delay Locked Loop).................................................................................................................................................................33

DLL locking operation................................................................................................................................................................................34

DLL filters...................................................................................................................................................................................................35

5.6. Pixel-field.............................................................................................................................................................................................36

5.6.1. Pixel coordinates..............................................................................................................................................................................36

5.6.2. Pixel architecture..............................................................................................................................................................................37

Single MGX mode (default).......................................................................................................................................................................38

Dual MGX mode with phase-shifted integration time (motion blur reduction)...........................................................................................38

Dual MGX mode with different integration times (High dynamic range)...................................................................................................38

Pixel binning...............................................................................................................................................................................................39

5.6.3. Pixel readout modes.........................................................................................................................................................................40

Resolution Reduction.................................................................................................................................................................................40

ROI (Region of Interest).............................................................................................................................................................................42

5.6.4. Pixel saturation detection.................................................................................................................................................................43

5.6.5. Ambient-light suppression................................................................................................................................................................43

5.7. Temperature sensors...........................................................................................................................................................................43

5.8. TOF camera interface (TCMI).............................................................................................................................................................44

5.8.1. TCMI clock mode..............................................................................................................................................................................44

5.8.2. Detailed TCMI timing........................................................................................................................................................................46

5.8.3. Single or continuous measurement control......................................................................................................................................47

Single measurement control......................................................................................................................................................................47

Continuous measurement control (auto-run).............................................................................................................................................47

5.8.4. TCMI data format..............................................................................................................................................................................47

5.8.5. Frame rates and data-out performance............................................................................................................................................48

Default QVGA frame and 3D TOF 4x DCS distance measurement..........................................................................................................48

Half QQVGA frame (160x60 pixel)............................................................................................................................................................50

5.8.6. Example applications of CPU architectures for high-speed frame data transfer.............................................................................51

5.9. Power consumption levels...................................................................................................................................................................52

6. Measurement Modes..............................................................................................................................................................................53

6.1. Distance measurement modes (3D TOF)...........................................................................................................................................53

6.1.1. Modulator..........................................................................................................................................................................................53

6.1.2. Sine mode (sinusoidal modulation)..................................................................................................................................................53

© 2017 ESPROS Photonics Corporation

Characteristics subject to change without notice

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Datasheet_epc660-V1.09

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