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STG3820BJR датащи(PDF) 1 Page - STMicroelectronics

номер детали STG3820BJR
подробное описание детали  Low voltage high bandwidth quad DPDT switch
PDF  20 Pages
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производитель  STMICROELECTRONICS [STMicroelectronics]
домашняя страница  http://www.st.com
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STG3820BJR датащи(HTML) 1 Page - STMicroelectronics

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This is information on a product in full production.
August 2013
DocID15992 Rev 4
1/20
STG3820
Low voltage high bandwidth quad DPDT switch
Datasheet
- production data
Features
 Ultralow power dissipation
–ICC = 1 µA (max.) at TA = 85 °C
 Low “ON” resistance
–RON = 5.4  (TA = 25 °C) at VCC = 4.3 V
–RON = 6.6  (TA = 25 °C) at VCC = 3.0 V
 Wide operating voltage range
–VCC (OPR.) = 1.65 V to 4.3 V
 4.3 V tolerant and 1.8 V compatible threshold
on digital control input at VCC = 2.3 V to 3.0 V
 4 select pins controlling 2 switches each
 Typical bandwidth (-3 dB) at 800 MHz on all
channels
 USB (2.0) high speed (480 Mbps) signal
switching compliant
 Integrated fail safe function
 Latch-up performance exceeds 100 mA per
JESD 78, Class II
 ESD performance exceeds JESD22
2000-V human body model (A114-A)
Applications
 Mobile phones
Description
The STG3820 device is a high-speed CMOS low
voltage quad analog DPDT (dual pole dual throw)
switch or 2:1 multiplexer/demultiplexer switch
fabricated in silicon gate C2MOS technology. It is
designed to operate from 1.65 V to 4.3 V, making
this device ideal for portable applications.
The SELm-n input is provided to control the
switches. The switches nS1 and mS1 are ON
(connected to common ports Dn and Dm
respectively) when the SELm-n input is held high
and OFF (high impedance state exists between
the two ports) when the SELm-n is held low. The
switches nS2 and mS2 are ON (connected to
common port Dn and Dm respectively) when the
SELm-n input is held low and OFF (high
impedance state exists between the two ports)
when the SELm-n is held high.
The STG3820 device has an integrated fail safe
function to withstand overvoltage condition when
the device is powered off. Additional key features
are fast switching speed, break-before-make-
delay time and ultralow power consumption. All
inputs and outputs are equipped with protection
circuits against static discharge, giving them ESD
immunity and transient excess voltage.
Table 1. Device summary
Flip Chip 30
(2.0 x 2.4 mm)
Order code
Package
Packing
STG3820BJR
Flip Chip 30
(2.0 x 2.4 mm)
Tape and reel
www.st.com


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