15

LT6301

sn6301 6301f

PACKAGE DESCRIPTIO

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.

–IN

Q1

Q5

R1

+IN

OUT

Q2

Q3

Q12

Q4

Q7

Q8

Q6

Q16

Q17

Q15

Q14

Q9

C2

C1

Q13

Q18

Q10

Q11

FE Package

28-Lead Plastic TSSOP (4.4mm)

(Reference LTC DWG # 05-08-1663)

Exposed Pad Variation EA

FE28 (EA) TSSOP 0203

0.09 – 0.20

(.0036 – .0079)

0

° – 8°

0.45 – 0.75

(.018 – .030)

4.30 – 4.50*

(.169 – .177)

6.40

BSC

13

4

5

6 7 89 10 11 12 13 14

19

20

22 21

15

16

18 17

9.60 – 9.80*

(.378 – .386)

7.56

(.298)

3.05

(.120)

28 2726 25 24 23

1.20

(.047)

MAX

0.05 – 0.15

(.002 – .006)

0.65

(.0256)

BSC

0.195 – 0.30

(.0077 – .0118)

2

RECOMMENDED SOLDER PAD LAYOUT

EXPOSED

PAD HEAT SINK

ON BOTTOM OF

PACKAGE

0.45

±0.05

0.65 BSC

4.50

±0.10

6.60

±0.10

1.05

±0.10

7.56

(.298)

3.05

(.120)

MILLIMETERS

(INCHES)

*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH

SHALL NOT EXCEED 0.150mm (.006") PER SIDE

NOTE:

1. CONTROLLING DIMENSION: MILLIMETERS

2. DIMENSIONS ARE IN

3. DRAWING NOT TO SCALE

SEE NOTE 4

4. RECOMMENDED MINIMUM PCB METAL SIZE

FOR EXPOSED PAD ATTACHMENT