Maximum ratings

ST6G3244ME

10/27

Doc ID 022157 Rev 2

3

Maximum ratings

Stressing the device above the rating listed in Table 4: Absolute maximum ratings may

cause permanent damage to the device. These are stress ratings only and operation of the

device at these or any other conditions above those indicated in Table 5: Recommended

operating conditions of this specification is not implied. Exposure to absolute maximum

rating conditions for extended periods may affect device reliability.

Table 4.

Absolute maximum ratings

Symbol

Parameter

Value

Unit

Maximum junction temperature

150

°C

(1)

Thermal resistance from junction to ambient

64

°C/W

Maximum power dissipation:

1W

Storage temperature range

–55 to 150

°C

Power supply

–0.3 to 4.6

V

Battery power supply

–0.3 to 5.5

V

CMDB, CLKB, DAT0B, DAT1B, DAT2B, DAT3B

V

–0.3 to 4.6

CMD.dir, CMD.h, CLK.h, CLK-f, DAT0.dir, DAT0.h, DAT123.dir, DAT1.h,

DAT2.h, DAT3.h, WP, CD

ESD

A-side (host CPU), all pins:

CMD.dir, CMD.h, CLK.h, CLK-f,

DAT0.dir, DAT0.h, DAT1.h,

HBM

JEDEC 22-A114

MM

JEDEC 22-A115

±200

V

B-side (SD Card), external pins:

CMDB, CLKB, DAT0B, DAT1B,

DAT2B, DAT3B, WP, CD,

Air discharge

IEC61000-4-2

±15

kV

Contact discharge

IEC61000-4-2

±8

kV

1.

The thermal resistance depends on the printed circuit board layout. To dissipate the heat efficiently away from the Flip-Chip

bumps, it is recommended to make the copper planes as large as possible and consider using thermal vias.