RC0201-R-SKE24L datasheet(9/10 Pages) YAGEO

9 / 10 page

Chip Resistor Surface Mount

www.yageo.com

Mar. 07, 2017 V.7

Product specification

SERIES

RC_L

0075 to 2512

Thermal

Shock

MIL-STD-202 Method 107G

-55/+125°C

Note Number of cycles required is 300.

Devices mounted

Maximum transfer time is 20 seconds.

Dwell time is 15 minutes. Air - Air

0075/01005: ± (1% +50mΩ)

< 50mΩf or

jumper

Others:

± (0.5%+50mΩ) for B/D/F tol

± (1%+50mΩ) for J tol

<50mR for jumper

Short Time

Overload

IEC 60115-1 4.13

2.5 times RCWV or maximum overload voltage

which is less for 5 seconds at room temperature

0075/01005: ± (2% +50mΩ)

< 50mΩf or

jumper

Others:

± (1%+50mΩ) for B/D/F tol

± (2%+50mΩ) for J tol

<50mR for jumper

No visible damage

Board Flex/

Bending

IEC 60115-1 4.33

Device mounted or as described only 1 board

bending required

bending time: 60± 5 seconds

0075/0100/0201/0402:5mm;

0603/0805:3mm;

1206 and above:2mm

0075/01005: ± (1% +50mΩ)

< 50mΩf or

jumper

Others:

± (1%+50mΩ) for B/D/F/J Tol

<50mR for jumper

No visible damage

Solderability

- Wetting

J-STD-002 test B

Electrical Test not required Magnification 50X

SMD conditions:

1st step: method B, aging 4 hours at 155 °C

dry heat

2nd step: leadfree solder bath at 245± 3 °C

Dipping time: 3± 0.5 seconds

W ell tinned

(>95% covered)

No visible damage

-Leaching

J-STD-002 test D

Leadfree solder ,260°C, 30 seconds immersion

time

No visible damage

-Resistance to

Soldering Heat

MIL-STD-202 Method 210F

IEC 60115-1 4.18

Condition B, no pre-heat of samples

Leadfree solder, 260 °C ± 5°C, 10 ± 1 seconds

immersion time

Procedure 2 for SMD: devices fluxed and

cleaned with isopropanol

0075: ± (3%+50mΩ)

<50mΩ for jumper

01005: ± (1% +50mΩ)

< 50mΩf or jumper

Others:

±(0.5% +50mΩ ) for B/D/F

tol.±(1% +50mΩ ) for J tol.

<50mR for jumper

No visible damage

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