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STM32L431 датащи(PDF) 192 Page - STMicroelectronics |
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STM32L431 датащи(HTML) 192 Page - STMicroelectronics |
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192 / 200 page ![]() Package information STM32L431xx 192/200 DocID028800 Rev 1 Figure 65. UFQFPN48 marking (package top view) 1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet qualified and therefore not yet ready to be used in production and any consequences deriving from such usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering samples in production. ST Quality has to be contacted prior to any decision to use these Engineering samples to run qualification activity. 7.9 UFQFPN32 package information Figure 66. UFQFPN32 - 32-pin, 5x5 mm, 0.5 mm pitch ultra thin fine pitch quad flat package outline 1. Drawing is not to scale. 2. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this backside pad to PCB ground. |
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