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STM32L431 датащи(PDF) 182 Page - STMicroelectronics

номер детали STM32L431
подробное описание детали  RTC with HW calendar, alarms and calibration
PDF  200 Pages
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производитель  STMICROELECTRONICS [STMicroelectronics]
домашняя страница  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32L431 датащи(HTML) 182 Page - STMicroelectronics

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Package information
STM32L431xx
182/200
DocID028800 Rev 1
Figure 55. WLCSP64 - 64-ball, 3.141 x 3.127 mm, 0.35 mm pitch wafer level chip scale
package recommended footprint
b(3)
0.190
0.220
0.250
0.0075
0.0087
0.0098
D
3.106
3.141
3.176
0.1223
0.1237
0.1250
E
3.092
3.127
3.162
0.1217
0.1231
0.1245
e
-
0.350
-
-
0.0138
-
e1
-
2.450
-
-
0.0965
-
e2
-
2.450
-
-
0.0965
-
F
-
0.3455
-
-
0.0136
-
G
-
0.3385
-
-
0.0133
-
aaa
-
-
0.100
-
-
0.0039
bbb
-
-
0.100
-
-
0.0039
ccc
-
-
0.100
-
-
0.0039
ddd
-
-
0.050
-
-
0.0020
eee
-
-
0.050
-
-
0.0020
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Back side coating.
3. Dimension is measured at the maximum bump diameter parallel to primary datum Z.
Table 96. WLCSP64 recommended PCB design rules (0.35 mm pitch)
Dimension
Recommended values
Pitch
0.35 mm
Dpad
0.210 mm
Dsm
0.275 mm typ. (depends on the soldermask
registration tolerance)
Stencil opening
0.235 mm
Stencil thickness
0.100 mm
Table 95. WLCSP64 - 64-ball, 3.141 x 3.127 mm, 0.35 mm pitch wafer level chip scale
package mechanical data (continued)
Symbol
millimeters
inches(1)
Min
Typ
Max
Min
Typ
Max



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